Socket A Heat sink procedure

[MD Willington]

Re: Socket A Heat sink procedure

I use arctic ceramique between my XP2200+ and the retail fan it came with, I rarely pull my machine apart...you can easily overcome the adhesion by running the processor for a few minutes, then pull the 3-pin fan adapter off the heatsink fan, only do this for a little while, then pull the power plug. The heatsink will easily come off.

MD

[dood]

Re: Socket A Heat sink procedure

Are the four rubber pads on the corners of Athlon and Durons necessary? I have a chip here that the pads have deteriorated and are turning to dust. I thought that they regulated the pressure put on the core, but I could be wrong... Should I worry about damaging this processor?

[Rainbow]

Re: Socket A Heat sink procedure

No, they're there only to help you put on the heatsink correctly. So you have to be careful when installing heatsink without them.

[Chris1992]

Re: Socket A Heat sink procedure

@MD Willington: Applied correctly it won't; correctly is just over the core. AS is actually much less adhesive than dried silicone gunk used widely in the P1/P2 era; the stock Intel gunk is quite adhesive too.

@Rainbow: That's why I don't like the Coppermine core processors much: FC-PGA and no rubber pads.

[dood]

Re: Socket A Heat sink procedure

Chris- yes, applied correctly it's fine, but the problem comes when some newby comes along and smears it all over everything, and then wants AMD to replace their processor because it doesn't work anymore. It's much easier for AMD to just say, look, our HSF should last you at least as long as the warranty period, so just use that and then do whatever the hell you want afterward...

[davmax]

Re: Socket A Heat sink procedure

I first used AS5 recently. The instructions state that it is non conductive so it cannot cause the bridge problems of the earlier conductive versions. There is a warning to be careful in that it has a high dielectric factor (increasing risk of capacitive coupling) there keep away from CPU components. I have had no problem taking CPUs on and off. Cannot speak about long term experience yet.

[Chris1992]

Re: Socket A Heat sink procedure

I've used AS5 since about August now; seems to clean well.

[davmax]

Re: Socket A Heat sink procedure

I first used AS5 recently. The instructions state that it is non conductive so it cannot cause the bridge problems of the earlier conductive versions. There is a warning to be careful in that it has a high dielectric factor (increasing risk of capacitive coupling) there keep away from CPU components. I have had no problem taking CPUs on and off. Cannot speak about long term experience yet.

[Chris1992]

Re: Socket A Heat sink procedure

Why the repeat post?

[davmax]

Re: Socket A Heat sink procedure

No comments to confirm reading of the first. Thought the sub thread may have been missed.

[willawake]

Re: Socket A Heat sink procedure

i was reading about that recently, when you pull the cpu out of the socket as well as the hsf.

oh yeah, a few posts ago i was just reading about it, now i actually did it. lucky no broke pins. i heard some sounds which i thought was the board flexing or something, no it was the AS5. it was stuck to the hsf real hard......



with s478 i cant see how you could get a twisting motion to avoid that. with lga775 ok. i cannot recommend AS5 anymore. there is danger of broken pins etc.

[Chris1992]

Re: Socket A Heat sink procedure

I've absolutely never had that prob with AS5. I did, however, have that problem with the intel retail TIM.