Hi guys.
I'm working on my first board reballing.
It's iphone 12 pro max and I made a mistake(s), but now to learn something, I hope.
Either I overheated the board and two ics fell off on it's own, or I clumsily took of top board and knock them off. Adrenaline was high at that moment so I do not recall best.
I repaired the damage by putting these components back in place. In some moment I begin tinkering about my future steps and about the fact that I have used low melt solder (138C) to put those components back. My line of thoughts was something like, if I use same solder...
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