Hi guys.
I'm working on my first board reballing.
It's iphone 12 pro max and I made a mistake(s), but now to learn something, I hope.
Either I overheated the board and two ics fell off on it's own, or I clumsily took of top board and knock them off. Adrenaline was high at that moment so I do not recall best.
I repaired the damage by putting these components back in place. In some moment I begin tinkering about my future steps and about the fact that I have used low melt solder (138C) to put those components back. My line of thoughts was something like, if I use same solder on ics and sandwich pads components will fall off again when I start heating the boards. I decided to desolder ics and use higher temperature solder and that's where things go south.
First I knock off small cap, which jump out of my tweezers to abbys and when I looked at boardview to find info for that cap I found out that much more components are missing, compared to a boardview.
Questions:
- Did I lose all that components when heating for separation and they mysteriously vanish or it is common thing to these boardview files are somewhat different?
- How do I need to repopulate a board for it to work?
- What do you think, was my idea about not using same solder unnecessary?
I'm working on my first board reballing.
It's iphone 12 pro max and I made a mistake(s), but now to learn something, I hope.
Either I overheated the board and two ics fell off on it's own, or I clumsily took of top board and knock them off. Adrenaline was high at that moment so I do not recall best.
I repaired the damage by putting these components back in place. In some moment I begin tinkering about my future steps and about the fact that I have used low melt solder (138C) to put those components back. My line of thoughts was something like, if I use same solder on ics and sandwich pads components will fall off again when I start heating the boards. I decided to desolder ics and use higher temperature solder and that's where things go south.
First I knock off small cap, which jump out of my tweezers to abbys and when I looked at boardview to find info for that cap I found out that much more components are missing, compared to a boardview.
Questions:
- Did I lose all that components when heating for separation and they mysteriously vanish or it is common thing to these boardview files are somewhat different?
- How do I need to repopulate a board for it to work?
- What do you think, was my idea about not using same solder unnecessary?
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