Hi,
I have a 2014 vintage Philips 60PFL8708S/12 that suddenly died in the middle of the kids watching a show.
The relevant service manual for the chassis is available here.
The TV no longer powers on, and leaving it powered on for a few minutes results in the layer-1 error with 2 blinks.
When I short the SDM to ground I get the layer-2 error code 53.
The inside of the TV has no damaged components and no swollen capacitors.
In SDM-mode when all the power rails are left on despite entering the protection mode, I tracked down and measured the voltage level and ripple of every single power rail with the help of the service manual, and I measured the switching frequency of every switching regulator as well, and they are all fine.
Error code 53 is described in table 5-2 in the service manual as:
The "Extra Info" section below the table says:
Error 53.
This error will indicate that the Fusion device has read his bootscript (when this would have failed, error 15 would blink) but initialization was never completed because of hardware problems (NAND flash, DDR...) or software initialization problems.
Possible cause could be that there is no valid software loaded (try to upgrade to the latest main software version).
Note that it can take a few minutes before the TV starts blinking LAYER 1 error = 2 or in SDM (maintain grounding continuously), LAYER 2 error = 53.
The debug-port 1CV5 is unpopulated but I soldered in wires on TXD-SERVICE and TXD-STANDBY so I could monitor them with serial adapters.
The TXD-SERVICE output is identical both with and without SDM enabled, it starts like this and then retries 6 more times:
The TXD-STANDBY output with SDM enabled is minimal, just a single iteration.
The TXD-STANDBY output without SDM enabled has a wierd line on one of the later iterations (highlighted below) before it finally gives up:
From the description in the service manual as well as from research on the internet regarding QFU chassis Philips TVs, it sounds like this error 53 problem could be caused by corruption in either the SPI Flash (7CT3, STMicro M25P05-AVMN6), in the NAND Flash (7JA0, Micron MT29F8G08ABACAWP:C), the EEPROM (7JA2, STMicro M24C64-WDW6), or it could be caused by the Fusion chip itself needing a BGA reflow.
To understand the next course of action, I have a few questions that I hope someone is able to answer:
1.
Is it possible to flash the TV with the latest autorun.upg (version 000.173.067.000 from 2016-01-28) without having booted the Fusion processor?
In my experience with enterprise network devices, there is often a way to program firmware from a rudimentary boot loader environment.
2.
How do I initiate the task that this line refers to in the TXD-STANDBY output without SDM:
Raghu: TRY WITH UPGRADE MODE
3.
Section 5.8.7 in the service manual mentions this:
Startup in the SW upgrade application and observe the Uart logging:
Starting up the TV set in the Manual Software Upgrade mode will show access to USB, meant to copy software content from USB to the DRAM.
Progress feedback can be found in the logging.
How do I initiate this "Manual Software Upgrade mode"?
4.
In the blog comments here, there is mention of using a simpler IR remote in a context where the EEPROM was mentioned (search for all instances of the text "remote"):
https://alpengeist-tvrepair.blogspot...-usb-uart.html
What task can be achieved with this IR remote control solution?
5.
In this post on this very forum someone posted a couple of versions of a Philips software program that's supposed to solve reboot issues:
https://www.badcaps.net/forum/showpo...&postcount=372
Sadly the 8000-series models are not listed as supported in the post comments.
Is this software tool meaningful in my situation?
Does anyone have it for my TV model or can I request it from Philips Support as a consumer?
6.
If all else fails, I have an XGecu TL866II Plus flash programmer, it supports the SPI Flash and the EEPROM, but maybe not the NAND Flash (the closest matching model name pattern is "MT29F" out of the full name "MT29F8G08ABACAWP:C").
Does anyone have firmware dumps of all these chips for this TV model?
7.
A practical question; I have read about the heat complaints of the QFU series and in this TV model they have added a thick piece of some sort of EMC foam that is glued with a very strong adhesive right underneath the Fusion chip, which is right in the middle of the SSB.
I'm assuming that this thick, strong foam has some heat transfer properties, because underneath the SSB the foam is in turn glued with the strong adhesive right against the big aluminium chassis.
The SSB only has the SPI Flash on the top side, so if I have to reach the EEPROM or NAND for a manual flash using the programmer, or if I have to ghetto-reflow the Fusion chip with my measly 858D heatgun, then I need to remove the SSB first.
Does anyone have a suggestion on how to detach the SSB in the correct manner from the foam underneath the PCB?
It's not mentioned in the service manual.
I can't get any tool that deep underneath the SSB, there is no space to rotate the PCB, and if I pull on the PCB by the edges it bends dangerously and the adhesive still doesn't let go.
Also, if the foam gets ruined in the process; Does anyone know what the name is of that material so I can buy a piece of replacement?
It seems vital to maintain what little cooling properties there are.
8.
Does anyone have any suggestion on how to proceed?
Many thanks in advance!
I have a 2014 vintage Philips 60PFL8708S/12 that suddenly died in the middle of the kids watching a show.

The relevant service manual for the chassis is available here.
The TV no longer powers on, and leaving it powered on for a few minutes results in the layer-1 error with 2 blinks.
When I short the SDM to ground I get the layer-2 error code 53.
The inside of the TV has no damaged components and no swollen capacitors.
In SDM-mode when all the power rails are left on despite entering the protection mode, I tracked down and measured the voltage level and ripple of every single power rail with the help of the service manual, and I measured the switching frequency of every switching regulator as well, and they are all fine.
Error code 53 is described in table 5-2 in the service manual as:
Code:
Description Layer 1 Layer 2 Monitored by Error/Prot Error Buffer/Blinking LED Device Defective Board MIPS doesn't boot (SW cause) 2 53 Stby µP P BL FUSION SSB
Error 53.
This error will indicate that the Fusion device has read his bootscript (when this would have failed, error 15 would blink) but initialization was never completed because of hardware problems (NAND flash, DDR...) or software initialization problems.
Possible cause could be that there is no valid software loaded (try to upgrade to the latest main software version).
Note that it can take a few minutes before the TV starts blinking LAYER 1 error = 2 or in SDM (maintain grounding continuously), LAYER 2 error = 53.
The debug-port 1CV5 is unpopulated but I soldered in wires on TXD-SERVICE and TXD-STANDBY so I could monitor them with serial adapters.
The TXD-SERVICE output is identical both with and without SDM enabled, it starts like this and then retries 6 more times:
Code:
0xF98A30F3 cycle now Jump to 0xB5034100 02 key is used Getting Hash... 0xBFC00000 01 10 00 00 52 55 00 0F 36 74 B3 80 00 00 00 00 Hash: 0xB5034570 1D 86 AE FF E3 71 65 8F 13 61 12 66 C4 5F 8D B0 Buffer for BIG NUM is at B5034E2C, size is 0440. nand.c:nand_readwithinpage 0x00000000 page is reading 0x00000004 0x00000007 0x00000000 StartUnit/EndUnit/offset Reading out data: 04 unit: waiting ECC result ready 00 bits error in the unit. 05 unit: waiting ECC result ready 00 bits error in the unit. 06 unit: waiting ECC result ready 00 bits error in the unit. 07 unit: waiting ECC result ready 00 bits error in the unit. nand.c:nand_readwithinpage 0x00000001 page is reading 0x00000000 0x00000003 0x00000000 StartUnit/EndUnit/offset Reading out data: 00 unit: waiting ECC result ready 00 bits error in the unit. 01 unit: waiting ECC result ready 00 bits error in the unit. 02 unit: waiting ECC result ready 00 bits error in the unit. 03 unit: waiting ECC result ready 00 bits error in the unit. nand.c:nand_readwithinpage 0x00000001 page is reading 0x00000004 0x00000007 0x00000000 StartUnit/EndUnit/offset Reading out data: 04 unit: waiting ECC result ready 00 bits error in the unit. 05 unit: waiting ECC result ready 00 bits error in the unit. 06 unit: waiting ECC result ready 00 bits error in the unit. 07 unit: waiting ECC result ready 00 bits error in the unit. nand.c:nand_readwithinpage 0x00000002 page is reading 0x00000000 0x00000000 0x00000000 StartUnit/EndUnit/offset Reading out data: 00 unit: waiting ECC result ready 00 bits error in the unit. {preboot} <000> <010> <020>K <------ It ends here, right after the K, so the next iteration begins after that character.
Code:
BootMode B Trident MCU SDK, Chip type:Chip FUSION 77.04.08.00 Date:Jul 19 2013 Time: 15:36:29 Warning!!!: PowerON pin going to be configured Toggle ENABLE WOLAN tdShmInit Enable 12V dip detect STARTUP FAILURE GOING TO PROTECTION LAYER
The TXD-STANDBY output without SDM enabled has a wierd line on one of the later iterations (highlighted below) before it finally gives up:
Code:
BootMode B Trident MCU SDK, Chip type:Chip FUSION 77.04.08.00 Date:Jul 19 2013 Time: 15:36:29 Warning!!!: PowerON pin going to be configured Toggle ENABLE WOLAN tdShmInit Enable 12V dip detect HOST STARTUP TIMEOUT Going to Standby....! WOLAN and RESET ETHERNET DISABLED Toggle ENABLE WOLAN tdShmInit Enable 12V dip detect HOST STARTUP TIMEOUT Going to Standby....! WOLAN and RESET ETHERNET DISABLED Toggle ENABLE WOLAN tdShmInit Enable 12V dip detect HOST STARTUP TIMEOUT Going to Standby....! WOLAN and RESET ETHERNET DISABLED Toggle ENABLE WOLAN tdShmInit Enable 12V dip detect HOST STARTUP TIMEOUT Going to Standby....! WOLAN and RESET ETHERNET DISABLED Toggle ENABLE WOLAN tdShmInit Enable 12V dip detect HOST STARTUP TIMEOUT Going to Standby....! WOLAN and RESET ETHERNET DISABLED Toggle ENABLE WOLAN tdShmInit Enable 12V dip detect HOST STARTUP TIMEOUT Raghu: TRY WITH UPGRADE MODE <------ Line of interest. Going to Standby....! WOLAN and RESET ETHERNET DISABLED Toggle ENABLE WOLAN tdShmInit Enable 12V dip detect HOST STARTUP TIMEOUT STARTUP FAILURE GOING TO PROTECTION LAYER 1 Going to Standby....! WOLAN and RESET ETHERNET DISABLED
To understand the next course of action, I have a few questions that I hope someone is able to answer:
1.
Is it possible to flash the TV with the latest autorun.upg (version 000.173.067.000 from 2016-01-28) without having booted the Fusion processor?
In my experience with enterprise network devices, there is often a way to program firmware from a rudimentary boot loader environment.
2.
How do I initiate the task that this line refers to in the TXD-STANDBY output without SDM:
Raghu: TRY WITH UPGRADE MODE
3.
Section 5.8.7 in the service manual mentions this:
Startup in the SW upgrade application and observe the Uart logging:
Starting up the TV set in the Manual Software Upgrade mode will show access to USB, meant to copy software content from USB to the DRAM.
Progress feedback can be found in the logging.
How do I initiate this "Manual Software Upgrade mode"?
4.
In the blog comments here, there is mention of using a simpler IR remote in a context where the EEPROM was mentioned (search for all instances of the text "remote"):
https://alpengeist-tvrepair.blogspot...-usb-uart.html
What task can be achieved with this IR remote control solution?
5.
In this post on this very forum someone posted a couple of versions of a Philips software program that's supposed to solve reboot issues:
https://www.badcaps.net/forum/showpo...&postcount=372
Sadly the 8000-series models are not listed as supported in the post comments.
Is this software tool meaningful in my situation?
Does anyone have it for my TV model or can I request it from Philips Support as a consumer?
6.
If all else fails, I have an XGecu TL866II Plus flash programmer, it supports the SPI Flash and the EEPROM, but maybe not the NAND Flash (the closest matching model name pattern is "MT29F" out of the full name "MT29F8G08ABACAWP:C").
Does anyone have firmware dumps of all these chips for this TV model?
7.
A practical question; I have read about the heat complaints of the QFU series and in this TV model they have added a thick piece of some sort of EMC foam that is glued with a very strong adhesive right underneath the Fusion chip, which is right in the middle of the SSB.
I'm assuming that this thick, strong foam has some heat transfer properties, because underneath the SSB the foam is in turn glued with the strong adhesive right against the big aluminium chassis.
The SSB only has the SPI Flash on the top side, so if I have to reach the EEPROM or NAND for a manual flash using the programmer, or if I have to ghetto-reflow the Fusion chip with my measly 858D heatgun, then I need to remove the SSB first.
Does anyone have a suggestion on how to detach the SSB in the correct manner from the foam underneath the PCB?
It's not mentioned in the service manual.
I can't get any tool that deep underneath the SSB, there is no space to rotate the PCB, and if I pull on the PCB by the edges it bends dangerously and the adhesive still doesn't let go.
Also, if the foam gets ruined in the process; Does anyone know what the name is of that material so I can buy a piece of replacement?
It seems vital to maintain what little cooling properties there are.
8.
Does anyone have any suggestion on how to proceed?
Many thanks in advance!
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