Re: Is This Repairable ?
I've reflowed numerous PS3s, Xboxes etc with a bog standard variable hot air gun giving 100% success rate, although the fix lasted for varying times on each lasting for 2 weeks to 6 months.
The best way is to use a a bit of solder to test the temp, adjust the temp till it starts to melt and then go a tad higher, just a tad though, you'll want to shield all other components in direct contact with the heat from the air gun, so rap with silver foil and seal with kapton tape around the BGA. I have tried an up turned roasting tray covered in silver foil placed over a halogen hob set to low with the PCB on top, this is to try and warm it up helping to stop warping while your heating the BGA, it seems to work but I can't say conclusively.
Now, with a circular motion gently swing the heat gun around the BGA area about 1 inch above, mixing it up with up/down, side to side motions allowing a couple of seconds break every 10 seconds or so, do this for about a minute in total giving a minimum of 15 minutes for cooling down. As I said above, worked every time for me, just don't have the heat too high, it will kill the board.
Flux is a good idea as it allows the solder to "eat" into the contacts but as has been said, if left, it will damage the board so "No Clean" flux can be used but in my experience the fix with the PS3s lasts as just as long with out it as it does if used.
I've reflowed numerous PS3s, Xboxes etc with a bog standard variable hot air gun giving 100% success rate, although the fix lasted for varying times on each lasting for 2 weeks to 6 months.
The best way is to use a a bit of solder to test the temp, adjust the temp till it starts to melt and then go a tad higher, just a tad though, you'll want to shield all other components in direct contact with the heat from the air gun, so rap with silver foil and seal with kapton tape around the BGA. I have tried an up turned roasting tray covered in silver foil placed over a halogen hob set to low with the PCB on top, this is to try and warm it up helping to stop warping while your heating the BGA, it seems to work but I can't say conclusively.
Now, with a circular motion gently swing the heat gun around the BGA area about 1 inch above, mixing it up with up/down, side to side motions allowing a couple of seconds break every 10 seconds or so, do this for about a minute in total giving a minimum of 15 minutes for cooling down. As I said above, worked every time for me, just don't have the heat too high, it will kill the board.
Flux is a good idea as it allows the solder to "eat" into the contacts but as has been said, if left, it will damage the board so "No Clean" flux can be used but in my experience the fix with the PS3s lasts as just as long with out it as it does if used.
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