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IR6000 V4 and Ultrasonic Cleaner - need help

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    IR6000 V4 and Ultrasonic Cleaner - need help

    Hey guys,

    I bought several repair equipment from a closed shop, unfortunately the equipment came without manuals and some parts, on site manuals are very incomplete and I'm getting frustrated because I can't fully understand how they work. Some help from users with similar equipments would be appreciated.

    Scotle IR6000 V4
    Configuring bottom heaters was easy, set H and L temps and it's done.
    -The real problem is configuring top heater, programs and respective heating ramps. I saw a couple of videos and I understand how it works, but I'm getting completely lost on the configuration. Complete documentation would help understanding how to navigate through the configurations.
    Also, if you have some remove and reball profiles you'd like to share for this device, I'd appreciate.
    -Another thing missing is the serial cable. Not all that serious, but I'd like to grab the opportunity and ask help on building a cable serial to USB.

    Skymen Ultrasonic Cleaner JP-010S
    http://www.skymen.cc/product02/16/JP010S.html
    I want to use this mainly for phones droped in water.
    - What liquid do i use? It's so confusing, tab water, alcohol, solvent cleaner, mixes.. I can't figure out what I should use.
    - Also, any info on heating or ultrasound time profiles on this?

    Thanks in advance.
    Galaxy S6 Edge x2 (Gold&White)
    Asus GL552VW-i7 6700HQ|GTX 960M|15.6"FHD|16GB DDR4|512GB M.2 SSD+1TB SSD
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    #2
    Re: IR6000 V4 and Ultrasonic Cleaner - need help

    I heard from a friend that if you try to clean a semi faulty working cellphone mobo with the ultrasonic cleaner you can actual kill it.
    You bought the bga station , stick with the chip cleaning abs that's it.
    Last edited by dj_ricoh; 05-11-2014, 05:11 PM.
    Just cook it! It's already broken.

    Comment


      #3
      Re: IR6000 V4 and Ultrasonic Cleaner - need help

      Im using 100% IPA...
      But don't forget to buy cleaner with metal lid, otherwise the IPA fumes will melt it...
      But it's not only about cleaning...you need to rework all the corroded components...many times caps and filters going broken or missing after water damage... (Especially those in lcd circuit)
      You can't kill mobo in ultrasonic bath, however sometimes had ripped balls under pmic or other ic's which may have been corroded or had weak joint...but still better to reball in place than get return from customer after week or so...
      Last edited by loser18; 05-11-2014, 06:00 PM.

      Comment


        #4
        Re: IR6000 V4 and Ultrasonic Cleaner - need help

        http://bgamods.com/forum/viewforum.php?f=41

        Comment


          #5
          Re: IR6000 V4 and Ultrasonic Cleaner - need help

          about the bga unit.
          nobody can give you the "profile" as we call it.

          the heatup, sustain and cooling ramps are dependant on several factors.
          the solder on the parts,
          the flux you use.
          the equipment,
          the board itself.

          you have to work them out from flux datasheets & experiments.
          on the console forums, people guard the profiles they use like they are made of gold.
          a good profile will fixx almost every reflow, a bad one will fail a lot.
          as most people use the same kit, the profile is sometimes the only way they compete for customers.

          i'll give you some hints.
          1: bring the heat up slowly on the pre-heater.
          2: bring the main heater up to the temperature needed to melt the solder and sustain it for the minimum period to get a good liquid flow.
          3: drop the main heater down befoe you shutoff the pre-heater.

          it's al about not warping or de-laminating the pcb.
          and that's another thing, to stop warping you need a good pcb clamping frame.
          Last edited by stj; 05-11-2014, 07:46 PM.

          Comment


            #6
            Re: IR6000 V4 and Ultrasonic Cleaner - need help

            Thanks for the answers everyone.

            Originally posted by loser18 View Post
            Im using 100% IPA...
            But don't forget to buy cleaner with metal lid, otherwise the IPA fumes will melt it...
            But it's not only about cleaning...you need to rework all the corroded components...many times caps and filters going broken or missing after water damage... (Especially those in lcd circuit)
            You can't kill mobo in ultrasonic bath, however sometimes had ripped balls under pmic or other ic's which may have been corroded or had weak joint...but still better to reball in place than get return from customer after week or so...
            I have other questions..
            My machine has metal lid and basket, using IPA should I remove the basket to diminish the vapors released?
            Do you use heat? If yes, what temp?
            For how long you use ultrasounds? I've seen some videos up to 10min with water, will it be the same on IPA?


            Thanks anyway but I already have those manuals, unfortunately both Soctle and ACHI manuals don't explain how to navigate through ramps configuration..

            Originally posted by stj View Post
            about the bga unit.
            nobody can give you the "profile" as we call it.

            the heatup, sustain and cooling ramps are dependant on several factors.
            the solder on the parts,
            the flux you use.
            the equipment,
            the board itself.

            you have to work them out from flux datasheets & experiments.
            on the console forums, people guard the profiles they use like they are made of gold.
            a good profile will fixx almost every reflow, a bad one will fail a lot.
            as most people use the same kit, the profile is sometimes the only way they compete for customers.

            i'll give you some hints.
            1: bring the heat up slowly on the pre-heater.
            2: bring the main heater up to the temperature needed to melt the solder and sustain it for the minimum period to get a good liquid flow.
            3: drop the main heater down befoe you shutoff the pre-heater.

            it's al about not warping or de-laminating the pcb.
            and that's another thing, to stop warping you need a good pcb clamping frame.
            Nice tips on flux datasheets and clamping frame, all new to me. Will have to read a little more about flux, but regarding the frame, before I was thinking in stretching the frame and use corner holes to hold it, but now I've read your post I'm thinking that might warp the board.. Should I use a couple of straight metal rods to keep it as straight as possible instead of its original clamps? See pics for original clamps.


            I really need help in how to navigate through ramps configuration!
            I'm not being able to configure L1 temps after r1, much less r2,3, etc.. can't get to the nr. of ºC per second or configure the hold temp time, etc..
            And i have no idea how to save the prgrams!
            I know my main difficulty is understanding the menus navigation, if I could get some documentation on this it would do wonders for me!

            Thanks!
            Attached Files
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            Asus GL552VW-i7 6700HQ|GTX 960M|15.6"FHD|16GB DDR4|512GB M.2 SSD+1TB SSD
            Clevo W230SD - i7 4710MQ|GTX960M|13"QHD+|16GB DDR3L|500GB+256GB mSATA SSD+1TB HDD

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              #7
              Re: IR6000 V4 and Ultrasonic Cleaner - need help

              Hey guys, I finally caught a video that made me understood part of the machine and how to configure the ramps. I successfully removed a chip but I believe I removed some pads (3 in the upper right corner), see pics.

              I noticed that my bottom heater and board temp came higher much faster than the video.. In the video the temp came up slow and nice, the board temp was pretty much side by side with top heater and just a tad slower. In my experience, board temp was already at 178ºC when top heater was still arriving at 110ºC ramp..
              http://youtu.be/i0sSvmNOaic
              My profile was the same in the video.
              r1-0.30, l1-110, d1-60
              r2-0.55, l2-150, d2-30
              r3-0.55, l3-190, d3-30
              r4-0.55, l4-225, l4-120
              r5-end
              bottom heater ah-300, al-280
              My question is, can I slow down the bottom heater heating time?

              Thanks.
              Attached Files
              Galaxy S6 Edge x2 (Gold&White)
              Asus GL552VW-i7 6700HQ|GTX 960M|15.6"FHD|16GB DDR4|512GB M.2 SSD+1TB SSD
              Clevo W230SD - i7 4710MQ|GTX960M|13"QHD+|16GB DDR3L|500GB+256GB mSATA SSD+1TB HDD

              Try Harder!

              Comment


                #8
                Re: IR6000 V4 and Ultrasonic Cleaner - need help

                hi, on the upper right of bga i see some pin missing..... were those a Nc pins or they had connection point? if nc is not important if you damage them, but if they weere conncted then you have to rebuind them and work get harder (except that board was for testing as it is your first job .

                Best to get 5-1' board damaged where to practice.

                also a good idea is to spread solder paste and see if a 185° it is all melt properly, becouse some corner can get lower temp respect center and so on.... better practive very much about that.

                about ramp rate... dunno what that value stand for... ° celsius to get for each second?

                if it's that ill go for 1° at second till 150° then 1.5 max till 185° for leaded,

                1° till 190 for lead free then 1.5° till 225°

                important thing is also time u keep that temperature.

                before remove the bga, move it and check if it's all desoldered.

                https://www.youtube.com/watch?v=sZ5083Wvh1A

                here is me removing a lga socket. as u can see my temperature sensor is really wheaked (the original one) but with practice you can do a good work.
                (im waithing to buy a better thermocouple).

                look on youtube for some bga video for testing the machine (liquid solder paste, temperature checking, heated area zone...)

                for chean the bga, get a good goodwick remover. i have had one that damage the solder mask because the wire weere too small (in the goodwick)

                when desolder, is always better to add kapton+ alluminium like in my video.

                good work with your good machine.


                edit: looking better your picture, one cap got moved... so better kapton+ alluminium
                Last edited by dellxps15; 05-12-2014, 06:14 AM.

                Comment


                  #9
                  Re: IR6000 V4 and Ultrasonic Cleaner - need help

                  Your machine looks more pro...on my one there's no heat adjustement and it's only 50 watts...found out that for iphone logic boards 8 minutes per side is enough...then give it a good scrub with a toothbrush while still in tank...you can close the lid (it will save you some ipa)...about the heat I wouldn't use any or minimum setting if using 100% (99.9) ipa as it shouldn't be heated too much...

                  Oh, always check if there's any residue of solder or solder balls after finish as it may short your board (few times had some ball from bad cpu sticked near connector pins) and of course don't drink that stuff or you get very drunk and blind (not a good combination lol)
                  Last edited by loser18; 05-12-2014, 09:57 AM.

                  Comment


                    #10
                    Re: IR6000 V4 and Ultrasonic Cleaner - need help

                    Oh and if you have a basket just leave it inside...if you got enough space between bottom tank and bottom of basket there's no need to turn the boars over...

                    Comment


                      #11
                      Re: IR6000 V4 and Ultrasonic Cleaner - need help

                      Before anything else, thanks for such a detailed answer and all the help and advices given. I'm so grateful for your push in the right direction i might have to make a trip to around the world just to buy you a all beer.

                      Originally posted by dellxps15 View Post
                      hi, on the upper right of bga i see some pin missing..... were those a Nc pins or they had connection point? if nc is not important if you damage them, but if they weere conncted then you have to rebuind them and work get harder (except that board was for testing as it is your first job.
                      Best to get 5-1' board damaged where to practice.
                      Yeah this board is for testing.. I want to make sure I dominated both removing and reball before I go on other boards.

                      also a good idea is to spread solder paste and see if a 185° it is all melt properly, becouse some corner can get lower temp respect center and so on.... better practive very much about that.
                      will do, thanks.


                      about ramp rate... dunno what that value stand for... ° celsius to get for each second?
                      r1-0.30ºC per second, l1-110ºC range, d1-60 seconds pause before proceeding to ramp 2.

                      if it's that ill go for 1° at second till 150° then 1.5 max till 185° for leaded,
                      1° till 190 for lead free then 1.5° till 225°
                      isn't that too fast? I've read it's better to advance slowly to avoid warping or de-laminating the pcb..

                      important thing is also time u keep that temperature.
                      keep what temp? max temp? right now i have 120sec configured but i wait about 30sec and give it a nudge to see if it's ready to remove..
                      before remove the bga, move it and check if it's all desoldered.

                      https://www.youtube.com/watch?v=sZ5083Wvh1A

                      here is me removing a lga socket. as u can see my temperature sensor is really wheaked (the original one) but with practice you can do a good work.
                      (im waithing to buy a better thermocouple).

                      look on youtube for some bga video for testing the machine (liquid solder paste, temperature checking, heated area zone...)

                      for chean the bga, get a good goodwick remover. i have had one that damage the solder mask because the wire weere too small (in the goodwick)
                      I did noticed my goodwick remover might be too thin.. I removed the solder nicely but it fills really fast, forcing me to stop and adjust many times..
                      when desolder, is always better to add kapton+ alluminium like in my video.
                      edit: looking better your picture, one cap got moved... so better kapton+ alluminium
                      Yeah C643 moved but i believe it was the tweezers, not my aluminum tape.. Can you please upload a photo of your kapton+ alluminium and goodwick remover? I might not find those brands here but i can look for similar.
                      Galaxy S6 Edge x2 (Gold&White)
                      Asus GL552VW-i7 6700HQ|GTX 960M|15.6"FHD|16GB DDR4|512GB M.2 SSD+1TB SSD
                      Clevo W230SD - i7 4710MQ|GTX960M|13"QHD+|16GB DDR3L|500GB+256GB mSATA SSD+1TB HDD

                      Try Harder!

                      Comment


                        #12
                        Re: IR6000 V4 and Ultrasonic Cleaner - need help

                        Hey again,
                        Originally posted by loser18 View Post
                        Your machine looks more pro...on my one there's no heat adjustement and it's only 50 watts...found out that for iphone logic boards 8 minutes per side is enough...then give it a good scrub with a toothbrush while still in tank...you can close the lid (it will save you some ipa)...about the heat I wouldn't use any or minimum setting if using 100% (99.9) ipa as it shouldn't be heated too much...

                        Oh, always check if there's any residue of solder or solder balls after finish as it may short your board (few times had some ball from bad cpu sticked near connector pins) and of course don't drink that stuff or you get very drunk and blind (not a good combination lol)
                        Originally posted by loser18 View Post
                        Oh and if you have a basket just leave it inside...if you got enough space between bottom tank and bottom of basket there's no need to turn the boars over...
                        Yeah it seems my basket has enough space to clean both sides at once but lid doesn't close properly with basket in it..
                        Is it a bad idea to use duck tape to close it totally?

                        Thanks!
                        Attached Files
                        Galaxy S6 Edge x2 (Gold&White)
                        Asus GL552VW-i7 6700HQ|GTX 960M|15.6"FHD|16GB DDR4|512GB M.2 SSD+1TB SSD
                        Clevo W230SD - i7 4710MQ|GTX960M|13"QHD+|16GB DDR3L|500GB+256GB mSATA SSD+1TB HDD

                        Try Harder!

                        Comment


                          #13
                          Re: IR6000 V4 and Ultrasonic Cleaner - need help

                          It's all right mate...Lid is not important...You don't have to use it it at all, but I'm using cause don't want to breathe the vapors when don't have my mask on...also it vapors slower so your IPA will last longer...

                          Comment


                            #14
                            Re: IR6000 V4 and Ultrasonic Cleaner - need help

                            Originally posted by loser18 View Post
                            It's all right mate...Lid is not important...You don't have to use it it at all, but I'm using cause don't want to breathe the vapors when don't have my mask on...also it vapors slower so your IPA will last longer...
                            Yeah, you're not alone there! I also have no wish to breathe IPA vapors, that's why I ask if I can tape the lid. This way I'd wouldn't have to worry about it.
                            Galaxy S6 Edge x2 (Gold&White)
                            Asus GL552VW-i7 6700HQ|GTX 960M|15.6"FHD|16GB DDR4|512GB M.2 SSD+1TB SSD
                            Clevo W230SD - i7 4710MQ|GTX960M|13"QHD+|16GB DDR3L|500GB+256GB mSATA SSD+1TB HDD

                            Try Harder!

                            Comment


                              #15
                              Re: IR6000 V4 and Ultrasonic Cleaner - need help

                              I'm more paranoid about flux fumes...I'm always wearing a mask when reballing & even soldering...Some of them contains acid & don't want to know what the cheap Chinese ones are made from...I've heard that one guy (a technician) went to GP & they found something on his lungs...They couldn't figure out what it is for over two months...Then found out it is something from the flux...I'm just a hobbyist, but if I would have a proper workshop, the ventilation system is a must...

                              Comment


                                #16
                                Re: IR6000 V4 and Ultrasonic Cleaner - need help

                                defuxing a pcb should be done with the pcb on it's side so the crap falls away - if the tank is deep enough.

                                and i recomend you get a manual for your process controller units on the bga unit.

                                Comment


                                  #17
                                  Re: IR6000 V4 and Ultrasonic Cleaner - need help

                                  Here's the manuals I found. Unfortunately they don't say much..
                                  In example, no instructions or proper function description of functions like loop counter or power limit.. Also don't understand quite well what run prog and auto hand does..
                                  Attached Files
                                  Last edited by Learn2Day; 05-12-2014, 11:53 AM. Reason: manuals
                                  Galaxy S6 Edge x2 (Gold&White)
                                  Asus GL552VW-i7 6700HQ|GTX 960M|15.6"FHD|16GB DDR4|512GB M.2 SSD+1TB SSD
                                  Clevo W230SD - i7 4710MQ|GTX960M|13"QHD+|16GB DDR3L|500GB+256GB mSATA SSD+1TB HDD

                                  Try Harder!

                                  Comment


                                    #18
                                    Re: IR6000 V4 and Ultrasonic Cleaner - need help

                                    not those manuals.

                                    the bga units use off-the-shelf process controllers that have there own manuals.
                                    there ae usually 2 manuals.
                                    a general user-manual with wiring details etc.
                                    and a programming manual with details inc how to up/download from a serial port.

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                                      #19
                                      Re: IR6000 V4 and Ultrasonic Cleaner - need help

                                      How exactly do I find that? Where on the machine can I look for references?
                                      Galaxy S6 Edge x2 (Gold&White)
                                      Asus GL552VW-i7 6700HQ|GTX 960M|15.6"FHD|16GB DDR4|512GB M.2 SSD+1TB SSD
                                      Clevo W230SD - i7 4710MQ|GTX960M|13"QHD+|16GB DDR3L|500GB+256GB mSATA SSD+1TB HDD

                                      Try Harder!

                                      Comment


                                        #20
                                        Re: IR6000 V4 and Ultrasonic Cleaner - need help



                                        http://www.altec.cc/english/products...c900/PC900.htm

                                        use this to find stuff
                                        https://duckduckgo.com

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