Hello, Namaste.
We have an iphone 11 for which we had changed the NAND IC and upgraded from 64gb to 128gb.
After upgrading the iPhone shows a Temperature Sign but there is no heating in the board. We did a lot of trial and error and found that whenever the Charging Flex and Power Flex are connected together the sign shows. If either one is removed there is no such sign.
We replaced the lower board just to check if there was a problem with the connection pads maybe but the issue persists.
I think we have messed up while replacing the NAND. Any help from anyone will be highly appreciated. Thanks in Advance
We have an iphone 11 for which we had changed the NAND IC and upgraded from 64gb to 128gb.
After upgrading the iPhone shows a Temperature Sign but there is no heating in the board. We did a lot of trial and error and found that whenever the Charging Flex and Power Flex are connected together the sign shows. If either one is removed there is no such sign.
We replaced the lower board just to check if there was a problem with the connection pads maybe but the issue persists.
I think we have messed up while replacing the NAND. Any help from anyone will be highly appreciated. Thanks in Advance
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