I'm trying to reball a Z270 PCH, i've got the right stencil for the PCH and it's direct heat type.
I initially tried using 0.3mm solder balls (leaded type) but am having lots of problems with the balls not wetting to the chip, basically some of them just wont solder to the pads.
I'm making sure the chip is as clean (using ipa) then putting a thin layer flux on then putting in in the holding jig with the stencil on. I'm the heating to about 400degC with minimal airflow (4% on my Atten) but some balls just refuse to stick!!
I've repeated the above using solder paste and am getting similar results.
Anyone got any ideas were i'm going wrong??
I initially tried using 0.3mm solder balls (leaded type) but am having lots of problems with the balls not wetting to the chip, basically some of them just wont solder to the pads.
I'm making sure the chip is as clean (using ipa) then putting a thin layer flux on then putting in in the holding jig with the stencil on. I'm the heating to about 400degC with minimal airflow (4% on my Atten) but some balls just refuse to stick!!
I've repeated the above using solder paste and am getting similar results.
Anyone got any ideas were i'm going wrong??
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