I don't think that ceramic cap was across a power rail - at least not one of the major ones anyways. If that was the case, that ceramic cap would have been burned into a crater in the board, as VRMs on big cards usually have enough power to do that before SCP kicks in.
Yeah, I noticed that too. Well, the discoloration looks worse on the pictures than it actually is. Only the VRM area for the GPU core is discolored. As for the area under DVI connectors... it's mostly flux on there. And it doesn't look like flux from someone trying to reflow the card. Most likely just poor factory cleaning. I guess I will never truly know, though. Time will tell, I suppose, as I keep using this card. Probably not going to run into any issues right now, though - it's barely 17-18C in my room. Nice and chilly for my PCs. Me.... brrr, I don't like it, but that's just part of winter.
You don't actually need flux for the reflow. That's because it's the BGA between the GPU silicon die and the GPU substrate (the square PCB) that fails, not the BGA between the substrate and the board.
Not really. It's just draw of the luck.
Generally, silicon made for laptops is traditionally a little "higher grade", usually because mobile/laptops don't have as much cooling available and thus are expected to run hotter. But when it comes to reflows, it's just pure luck.
Not just BGA chips.
Many SMT components are moisture-sensitive and thus typically baked before getting sealed in moisture-resistant bags and shipped off for assembly.
Baking for a day is a little excessive. But 1-4 hours at 100-110C will usually do the trick. I forgot what guide I read that in. It wasn't Intel. I think it was just for some SMD IC I purchased from Digikey.
Moisture gets trapped in the PCB over time. So even if you do your reflow when it's very dry, you can still popcorn a chip if there is moisture in the PCB layers, which can happen even if the PCB/device was stored in normal everyday room conditions. I usually let my boards sit for 5-10 minutes at ~100-120C before beginning the reflow process. This isn't enough to get rid of all of the moisture, but it does help.
Popcorning can also occur if the heat is too high.
Just because you do one PCB/card/board at XX degrees for TT minutes, doesn't mean that the next (different) PCB will heat up the same way. This is especially true with video cards, where some have very thick copper planes from a VRM that is placed relatively far from the GPU chip, and others with same traces, but placed very close to the GPU. Obviously the card with the bigger/longer/heavier copper planes will sink more heat, and thus won't heat up to the same temperature. Or taking it the other way around... you could do a large PCB just perfectly and then completely burn a small card following your same reflow "profile". That's what actually made me popcorn my XFX HD5750. Normal ATI HD4850 cards tend to sink quite a bit of heat. The 5750 is slightly smaller and probably needed less heat. I didn't factor for that (nor did I care to after two unsuccessfull reflows), so I cranked the heat up... and that was the end of that (already dead) GPU.
Good solution, but only if you can find the chips.
When you can't or they go for more than the device you're trying to repair, it's just not worth it. At that point, you just reflow it, and if lucky, extend the useful life just a little more.
Won't do for some of the big video cards. I tried this with a bunch of ATI-built HD4850 and 4870 cards first. None of them came back until I really cranked the heat up and hit over 205-210C for at least 10 seconds on the core (that is, 205-210C with heat source removed - i.e. actually heating the card close to proper solder reflow temperatures.)

Although the GPU I’m about to show is not exactly “modern” anymore, it is still fairly relevant in terms of hardware design to modern GPUs. The video card I have is a Gigabyte Radeon HD6850 with 1 GB of gDDR5 RAM. Pictures of the video card, just for reference:
All resistors on the 5th RAM chip read normal resistances just like the other chips. I removed a ceramic cap from another RAM chip that corresponded to the same spot as the bad one on the 5th chip, and measured its value: 680 nF. Welp, I didn’t have that value, but I do know my scrap Xbox 360 motherboards have many 220 nF SMD MLCCs. So I stacked two on top of each other for a total of ~440 nF. Three would have been ideal, but I didn’t feel like stacking do many on top of each other. Figured the ~440 nF capacitance should hopefully be close enough.
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