Nasty underfill

Collapse
X
Collapse
 
  • Page of 1
  • Time
  • Show
Clear All
new posts
Previous template Next
  • randoomkiller
    New Member
    • Oct 2021
    • 9
    • Hungary
    #1

    Nasty underfill

    Hey there,

    I am currently working on a hobby project of mine where I try to replace a set of soldered on rams to 16GB just for the heck of it, but I've encountered a problem in the form of a nasty underfill.

    Look at the images


    What do you suggest?

    I've tried to scrape it off with a Qian Li 007, and even to move under a hot air station, but no luck.
    Attached Files
    Tags: None
    • mcplslg123
      Badcaps Legend
      • Jun 2015
      • 7262
      • india
      #2
      Re: Nasty underfill

      Is it Lenovo which uses a black colored glue to seal all bga's. Its very hard to remove them without damaging the foil on mb.

        Comment

        • randoomkiller
          New Member
          • Oct 2021
          • 9
          • Hungary
          #3
          Re: Nasty underfill

          Has anyone managed to do it?

          Also I've read that you could just "mill it down", could that work?

            Comment

            • RethoricalCheese
              Badcaps Legend
              • Mar 2013
              • 1518
              • Estonia
              #4
              Re: Nasty underfill

              That's a 2nd gen carbon, yes?

              One method would be to heat it long enough to be sure that solder has melted and then use qianli to pry it off. Takes a bit of force.

              The other would be milling, indeed. Look for videos of iphone milling. They do it with CPU-s.

              Neither method is great or easy but it's not an easy task anyway.

                Comment

                • mon2
                  Badcaps Legend
                  • Dec 2019
                  • 14101
                  • Canada
                  #5
                  Re: Nasty underfill

                  Gathering that you are using a bottom side pre-heater to assist in the removal?

                  Email Rewa with the details. They most likely have a solution for this by now in Shenzhen / China.

                  Do update your progress here.

                    Comment

                    Previous template Next

                    Related Topics

                    Collapse
                    • deep000
                      Looking for a budget hot air soldering station for hobby use
                      by deep000
                      Hi,
                      I'm looking to get on Aliexpress a hot air soldering station for hobby use, nothing too fancy, just something "reliable" and budget-friendly.
                      Any recommendations for a "good" cheap one that gets the job done?
                      Thanks in advance
                      04-25-2025, 02:29 AM
                    • Adenitz
                      Underfill chips
                      by Adenitz
                      Hello,
                      Today I saw a video from PLD in which he replaced two chips CD3215 that had underfill. It was pretty complicated procedure of removing the chips and cleaning the board. What exactly is the purpose of underfill? Is it to protect chip‘s pins from liquid damage, to improve resistance to stress or shocks or something completely different?

                      Thanks.
                      09-12-2022, 01:56 PM
                    • rediii
                      ThinkPad X1 Yoga Gen 6 series fault
                      by rediii
                      - it is urgently recommended to update the bios to the latest version to prevent this series fault!
                      - repaired 20 of them: in some cases all three chips have had to be replaced
                      - all parts ordered here: mouser.com

                      - exploded next gen fet (mainly used usb c port - replace it) - 20 times (15 times this was the only fault)
                      TPD4S311YBFR
                      TI USB Interface IC
                      US HTS:8542390001 ECCN:EAR99 COO:PH
                      - exploded ov protection ic
                      FPF3380UCX
                      onsemi Power Switch ICs - Power Distribution
                      TARIC:8542399000 ECCN:EAR99 COO:PH
                      -> you can use...
                      05-01-2024, 10:26 AM
                    • ktmmotocross
                      MSI RTX2070 artefacts on load - replaced rams still bad
                      by ktmmotocross
                      I have this rtx2070 that have artefcts on load. mats show maybe two chips. after replace C1 and D0 chips it shows oposite chips. im confiused. is that because of MICRON ic? i know they goes bad in mass but this oposite errors confuse me

                      MEmory ic is D9WCW...
                      05-28-2022, 12:52 AM
                    • piernov
                      NVidia bumpgate
                      by piernov
                      Just archiving everything related to bumpgate since most stuff has disappeared from Google. Maybe people will finally take the time to read some of it and stop shouting "reflow gpu" at every occasion but rather try to understand what the real issue is…
                      Interesting parts about the failure analysis are "Why Nvidia's chips are defective" and "Why Nvidia's duff chips are due to shoddy engineering"


                      May complete this post at a later date with more details.
                      Basically issue is a combination of thermal dissipation of the chip with hotspot,...
                      03-27-2021, 10:34 AM
                    • Loading...
                    • No more items.
                    Working...