Nasty underfill

[randoomkiller]

Hey there,

I am currently working on a hobby project of mine where I try to replace a set of soldered on rams to 16GB just for the heck of it, but I've encountered a problem in the form of a nasty underfill.

Look at the images


What do you suggest?

I've tried to scrape it off with a Qian Li 007, and even to move under a hot air station, but no luck.

[mcplslg123]

Re: Nasty underfill

Is it Lenovo which uses a black colored glue to seal all bga's. Its very hard to remove them without damaging the foil on mb.

[randoomkiller]

Re: Nasty underfill

Has anyone managed to do it?

Also I've read that you could just "mill it down", could that work?

[RethoricalCheese]

Re: Nasty underfill

That's a 2nd gen carbon, yes?

One method would be to heat it long enough to be sure that solder has melted and then use qianli to pry it off. Takes a bit of force.

The other would be milling, indeed. Look for videos of iphone milling. They do it with CPU-s.

Neither method is great or easy but it's not an easy task anyway.

[mon2]

Re: Nasty underfill

Gathering that you are using a bottom side pre-heater to assist in the removal?

Email Rewa with the details. They most likely have a solution for this by now in Shenzhen / China.

Do update your progress here.