Because that's what it looks like. At first I followed advice from a poster here and went easy with 250ºC mid air, then lost my patience and went 500ºC full air. It refuses to come out! What is happening here?SOICs on this same MB are tough to desolder as well and I´ve only managed to remove them by adding solder blobs first. You can't do the same with this type of packages not to mention QFNs. Help

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