Hello,
Need some information regarding pre heating/baking of laptop motherboard prior to removing and soldering large BGA chips like GPU and North bridge.
I am aware that the BGA themselves need to be heated for 105 - 110°C for at least 5 hours but need info on how to get rid of moisture from the PCB and therefore avoid and pop corning on the PCB itself.
1. Is it recommended to pre heat the motherboard to remove moisture from the PCB before removing a BGA?
2. If so, what is the recommended temperature and time for preheating/baking?
3. What equipment is required to perform such operation?
Thanks
Need some information regarding pre heating/baking of laptop motherboard prior to removing and soldering large BGA chips like GPU and North bridge.
I am aware that the BGA themselves need to be heated for 105 - 110°C for at least 5 hours but need info on how to get rid of moisture from the PCB and therefore avoid and pop corning on the PCB itself.
1. Is it recommended to pre heat the motherboard to remove moisture from the PCB before removing a BGA?
2. If so, what is the recommended temperature and time for preheating/baking?
3. What equipment is required to perform such operation?
Thanks
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