Heat guns near BGA packages

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  • spleenharvester
    Badcaps Veteran
    • Mar 2010
    • 882
    • UK

    #1

    Heat guns near BGA packages

    Basically I need to replace a QFN chip, and given the solder joints are underneath, I need to use a heatgun.

    The chip is about 7cm away from the Northbridge chip - an Intel HM55 so not really so much prone to failing.

    1) Is this likely to comprimise the structure of the BGA package if there is nothing wrong already?

    2) Should I have the heatgun directly over the BGA package once I'm done soldering the QFN chip to make sure the BGA joints are all uniform?

    I see the term "light reflow" being thrown around a lot as a method of checking if a BGA is at fault, but this seems like a very shotgun approach to me, hence the above questions.

    Cheers
    Dell E7450 | i5-5300U | 16GB DDR3 | 256GB SSD
  • whaldsz
    Badcaps Veteran
    • Apr 2013
    • 395
    • Philippines

    #2
    Re: Heat guns near BGA packages

    you can use kapton/aluminum tape to cover the bga chip.

    Comment

    • thesloc
      Banned
      • Dec 2011
      • 587

      #3
      Re: Heat guns near BGA packages

      7cm is pretty far.

      As long as you don't move the board while applying heat that much, the bridge will be fine...

      use good flux tho, like amtec to smooth the process.

      Comment

      • spleenharvester
        Badcaps Veteran
        • Mar 2010
        • 882
        • UK

        #4
        Re: Heat guns near BGA packages

        I'm still using that horrid cheap yellow gooey flux lol. Need to bin it already, it's crap.

        Cheers!
        Dell E7450 | i5-5300U | 16GB DDR3 | 256GB SSD

        Comment

        • tomodachi
          Badcaps Veteran
          • Apr 2012
          • 593
          • Turkey

          #5
          Re: Heat guns near BGA packages

          Originally posted by spleenharvester
          Basically I need to replace a QFN chip, and given the solder joints are underneath, I need to use a heatgun.

          The chip is about 7cm away from the Northbridge chip - an Intel HM55 so not really so much prone to failing.

          1) Is this likely to comprimise the structure of the BGA package if there is nothing wrong already?

          2) Should I have the heatgun directly over the BGA package once I'm done soldering the QFN chip to make sure the BGA joints are all uniform?

          I see the term "light reflow" being thrown around a lot as a method of checking if a BGA is at fault, but this seems like a very shotgun approach to me, hence the above questions.

          Cheers
          7 cm is very safe distance for heatgun replacement, but if you hesitate you can use aluminium foil to protect the hm55 or others which you dont want to fry.

          Comment

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