Desoldering - soldering BGA chip close plastic mini fpc connectors ?

[corrize]

Hello, I need your advise please ? I need to remove and replace the BGA black chip with fpc connectors around. The PCB is small, from camera.

There is no plastic component directly under, on the other face, (only fuse and oscillator I can remove if they are sensitives to heat), but there is a lot of very small smd components I don't want to desolder by mistake.

I have :
- hot air, and a ll stuff around
- true kapton tape
- 140 and 180 degree soldering paste
- bismuth
- little hot plate 250 degree max
- the new BGA chip with probably lead free solder balls

The best way is by bottom ? How to be sure hot air dont push away the components on the bottom please ?

[Aliencomputres]

heloo,
use aluminium tape or kapton to isolate/desolder fpc connectors .

[corrize]

I never tried to desolder with connectors so close. I tried with connectors around, with kapton on it, and direct hot air, and after the connector was a little rounded… I'm scared.

Ok thx, I like this way : desolder connectors first. Because the new chip with leed free balls could be long to solder and with high temp. I guess it's better to solder with hot air by the top.

The way I see :
1 - desolder connectors by bottom, help with 140 solder paste on connectors : that could decrease hot air temp needed (360 degree ?) and help to keep the other components in place ?
2 – increase hot air temp (400 ?) to direct desolder BGA and resolder new one.
3 – resolder connectors with 180 solder paste, with hot air by bottom (360 degree ?) That could help to no reflow the chip and other components around ?

It is the best way for you ? (If I burn connectors, I could never found new ones)

[CapLeaker]

2 more options: If you replace that chip anyway, you can also dill or dremel the lid away, then unsolder the rest with a regular soldering iron. Or you replace the connector and the IC.
I think preheat is key, cover the connector with aluminum tape, then just a short hot blast on the IC to take it off.

[mateusassuncao]

It's not difficult!
Use aluminum tape or kapton to isolate as my friend Aliencomputres said!
Use a little solder flux on the BGA.
With the FPCs well insulated, you can use the air station at 380º without any problems!
But apply the heat on top of the BGA, in seconds it will "swim" on the board!
Remember to fix the board well, to remove the chip!
Then clean it well, remove the old solder, with desoldering mesh, flux on it, and you can install the new BGA without any problems!
Good luck!!!