Hot Air Station

[tech2014]

I use a hot air station to remove ICs from circuit boards. I found that sometimes the laminate on the board will lift up. Does anyone know what to do to prevent this, other then using a lower heat setting.

[ReeceyBurger123]

Re: Hot Air Station

You answered your own question basically. Your heating the board too fast at too higher heat. You need to start low then work up to the point to whatever solder on the board melts. Known as hot air preheating.

[dick_barton]

Re: Hot Air Station

I believe that the use of a pre-heater for the underside of the board is the answer. This helps to minimize the heat stress.

[flocko]

Re: Hot Air Station

The use of low melt solder and lots of flux will help on most ICs, but if you are talking buffer ICs that have solder tabs on the rear then preheating the back of the board with hot air is a must

[Alastair E]

Re: Hot Air Station

Flocko is correct. Pre-heat the board on underside till topside is around 120-150 degrees (Use IR Thermometer if unsure), Then proceed on the top side--and DONT rush it!

Can take around 10-15 minutes to remove a buffer-chip carefully, sounds to me you are just going WAY too fast and scorching the crap outta the board

[tech2014]

Re: Hot Air Station

Flocko is correct. Pre-heat the board on underside till topside is around 120-150 degrees (Use IR Thermometer if unsure), Then proceed on the top side--and DONT rush it!

Can take around 10-15 minutes to remove a buffer-chip carefully, sounds to me you are just going WAY too fast and scorching the crap outta the board

You are correct. Luckily I am practicing on discarded boards before doing anything on a customers board. Its a gate driver IC on the bottom of an XSUS board. There is no solder pad underneath the part.

[CapLeaker]

Re: Hot Air Station

The use of low melt solder and lots of flux will help on most ICs, but if you are talking buffer ICs that have solder tabs on the rear then preheating the back of the board with hot air is a must

x2

[Alastair E]

Re: Hot Air Station

You are correct. Luckily I am practicing on discarded boards before doing anything on a customers board. Its a gate driver IC on the bottom of an XSUS board. There is no solder pad underneath the part.

Best way on these--

Two soldering-irons and Leaded/low-temp solder....

Heat both sides At the same time, part comes away with no problem at all, no damage and no dramas.

When you get good at it--One iron is all it takes....

[tech2014]

Re: Hot Air Station

Best way on these--

Two soldering-irons and Leaded/low-temp solder....

Heat both sides At the same time, part comes away with no problem at all, no damage and no dramas.

When you get good at it--One iron is all it takes....

I used to do that all the time, but thought what the hell I have a hot air station lol. I will have to find my other iron, in my shop somewhere.

[flocko]

Re: Hot Air Station

Hot air has its place in some jobs,but for IC removal I think a temp controlled iron and low melt solder wins every day. on a crowded PC board (T.Con and the like) with hot air you can blow small components off there pads never to see them again, and the board can end up looking like a war zone