By all accounts the new FSP models are excellent. How then are they getting away with smaller heat sinks?. I always thought a heavier psu was an indicator of quality.
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Re: Latest FSPxxx-xxGLC/GLN models have relatively small heat sinks. What's going on?
like this?
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Re: Latest FSPxxx-xxGLC/GLN models have relatively small heat sinks. What's going on?
Xbit Labs reviewed the 700W and somewhat reverse engineered it. Basically, they're using a higher switching frequency and higher quality parts on the output side. Very efficient.Originally posted by frankgehry
The above pic is of my FSP600-80GLC
Review of the Epsilon 700W can be found in here: http://www.xbitlabs.com/articles/oth...u-roundup.htmlComment
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Re: Latest FSPxxx-xxGLC/GLN models have relatively small heat sinks. What's going on?
Higher Efficiency=less heat...."The one who says it cannot be done should never interrupt the one who is doing it."Comment
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Re: Latest FSPxxx-xxGLC/GLN models have relatively small heat sinks. What's going on?
Hmmm ... higher switch frequency can mean a smaller transformer, but unless the switch devices and O/P rectifiers are faster, a higher switch frequency can mean higher losses. OTOH, if larger fans are used - e.g 120mm instead of 80mm - airflow may be greater and the heatsinks may be more effective.PeteS in CA
Power Supplies should be boring: No loud noises, no bright flashes, and no bad smells.
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To kill personal responsibility, initiative or success, punish it by taxing it. To encourage irresponsibility, improvidence, dependence and failure, reward it by subsidizing it.
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Re: Latest FSPxxx-xxGLC/GLN models have relatively small heat sinks. What's going on?
I as far as i know this is due the new environmental and disposal guidlines. This mean that the wight should be minimized too. At least for the Freierde PSU i have read those statements. Inmy opinion not that good, byt anyway, i thrust in FSP knowledge on this side. If they are suinbg a active clamping technik with mosfets, than there are mutch fewer losses an thus this should be ok, but i doubt they do so..Comment
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Re: Latest FSPxxx-xxGLC/GLN models have relatively small heat sinks. What's going on?
nice article. xbit labs is always great to read. it says they are using smaller O/P rectifiers but more of them than usually expected and in parallel.Comment
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Re: Latest FSPxxx-xxGLC/GLN models have relatively small heat sinks. What's going on?
After reading that xbit arcticle, i am a litle bit dissapointed that FSP don`t use active clamping in that high end unit. I think if they replaced the secondary diodes with an fast and realy low RDSon mosfet this unit could be in the 90% + efficiency area. I haven`t thought, that those high w and super efficient psu units going on in using simple shotky diodes. I deed, active clamping will cost a few bukc`S more for those high A mosfets, but i think for 180$ this should be easily possible to build.
Until i read this arctilce, i always thought that it dosn`t mather how mutch diodes there will be in parallel, as the loss is always the same. Only heat will be distributed about a bigger cooling area, but as far as i think the absolut losses won`t be reduced. May be i try that with some chepo PSU, adding some Diodes in paralle would be a cheap and easy mod if that will improve the efficiency.Last edited by gonzo0815; 04-05-2006, 04:54 AM.Comment
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Hi,
solder joints on heat sinks - how much do they matter? Could poor joints on heat sink cause issues if they are not properly joining to hot ground?
I'm looking at power source module of Panasonic plasma TV and I see many of these having visually poor quality, but could they matter? In general I would guess no, but I saw a video where someone was stressing out the importance of tightening the screws when fastening the power source board specifically for the ground to be connected properly.
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Hi,
Can somebody share Lenovo Latest Bootable USB Maintenance Key?
I need to update model number and serial on Thinkpad E15 Gen 1
E14 Gen 2
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Mounting and Handling Guidelines for TO220 TO220F TO247 Cases / Packages
The TO220, TO220F and TO247 are the popular packages for power devices because of their versatility and ability to dissipate moderate amounts of heat. This application note describes the basic guidelines for handling power MOSFETs in TO220, TO220 and TO247 packages shown in Figure 1. Please note that only mechanical and soldering guidelines are covered here. Additional precautions are required for isolating high voltage rated devices to meet safety regulations.
Securing a good thermal interface between...10-07-2024, 04:35 AM -
detecting heat with IR LED receiver
I have some dark IR led, and want to know if it is be situable to detect pure heat (not visable glow ir radiation) in well lighted desk?
So, if I put hand over it in near distance like few centimeters, that detect rising heat, not covering it from light.
Something like termal camera, but in one spot, any simple circuit?... -
Hello everyone,
i was reballing the power manger of a moto g84, after applying heat i tried to power on and it wouldn’t.
i injected 1.5v to some capacitor that seem in short because both side beep if tested.
when i inject i feel the cpu burning;
since the cpu is exactly on the other side of the board, is that possible that the heat from the reballing damaged the cpu? do you know where i can find schematics or what can i do?
i know this is not enough to explain the situation so if you need any other info ask me please!
Thank you very much in advance11-08-2024, 02:13 PM
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