Reballing HP G62 Intel ATI HD5470

[Th3_uN1Qu3]

First time with the Intel version of this laptop. Powers on but no display, obviously none other than the GPU at fault. It's an ATI HD5470 on this one.

Same issue as the RS880M/HD4250 - the pads on the mainboard are way, way, way too small. Oh well, that's more profits for me.

Left it running in RTHDRIBL and it was still ok when i came back 5 hours later, with a maximum recorded temperature of 77C, so i think it's gonna be fine. The owner has picked it up just now.

[dj_ricoh]

Re: Reballing HP G62 Intel ATI HD5470

Respect for your work!

Q: universal stencil or for that chip?

nvm saw the stencil in your hand :P



...

one thing i still don`t get it; ofc because i don`t have the space to get a bga station and do this process but i`m asking for ... maybe ... future ... luck ... i`ll get a station and know this, do you heat with stencil on or lift the stencil the heat it up?

[mockingbird]

Re: Reballing HP G62 Intel ATI HD5470

Good job!

Love it.

[Th3_uN1Qu3]

Re: Reballing HP G62 Intel ATI HD5470

do you heat with stencil on or lift the stencil the heat it up?

There are two kinds of stencils. Direct heat and indirect heat. I use the direct heat stencils so the stencil stays in place when soldering the balls to the chip, it comes off afterwards.

With the indirect heat type, the stencil is lifted first and then heat is applied. But since i use a hot air station for soldering the balls to the chip, i must use the direct heat type, otherwise the air will move the balls towards each other and make a big mess.

Indirect heat stencils can only be used with a IR station or a hot plate.

[reizal]

Re: Reballing HP G62 Intel ATI HD5470

good job bro, new experiences

[mockingbird]

Re: Reballing HP G62 Intel ATI HD5470

There are two kinds of stencils. Direct heat and indirect heat. I use the direct heat stencils so the stencil stays in place when soldering the balls to the chip, it comes off afterwards.

With the indirect heat type, the stencil is lifted first and then heat is applied. But since i use a hot air station for soldering the balls to the chip, i must use the direct heat type, otherwise the air will move the balls towards each other and make a big mess.

Indirect heat stencils can only be used with a IR station or a hot plate.

Are you sure about this? I thought I saw some reflow videos where they used hot air after removing the stencils... Maybe they used really tacky flux?

[ktmmotocross]

Re: Reballing HP G62 Intel ATI HD5470

Are you sure about this? I thought I saw some reflow videos where they used hot air after removing the stencils... Maybe they used really tacky flux?

only with solder paste.

but why using hot air when IR is soooooo low cost now
http://www.ebay.com/itm/80-80mm-450W...item3397a4dcc1

[dellxps15]

Re: Reballing HP G62 Intel ATI HD5470

that was my first success notebook. on mine i had to reball also chipset


good work as always.


me too for small chip use dh steancil. very good and easy to reball.

[highpulse]

Re: Reballing HP G62 Intel ATI HD5470

i do work like this , 9090 stencils , remove stencil balls are free , and use hot air , no merges or balls runing away , its all about wind speed and the type of flux used

[dellxps15]

Re: Reballing HP G62 Intel ATI HD5470

and i suppose also on ball size tried many time doing that with 0.45 with no good success. i cant even image doint hot air and 9090 with 0.3 balls

[polytek]

Re: Reballing HP G62 Intel ATI HD5470

Very nice work, you are good in reballing, i want to ask you a question what time do you spend to do this?

[senchire]

Re: Reballing HP G62 Intel ATI HD5470

You can reball it in under 45 min from my experience.
Lift = 15 min (with MB cleaning)
Ball placement = 15 min (with chip cleaning)
Chip placement = 13 min.
This is from my profile, so some ppl do it faster some slower.

[Th3_uN1Qu3]

Re: Reballing HP G62 Intel ATI HD5470

It depends on the chip and board, some need to be cleaned more carefully so take longer, i'd say anywhere from 40 min to 1h30 for the whole process from start to finish, complete with cooling down of the board and initial power up.

It also depends on whether i've been lazy and didn't bother to clean my stencils properly from flux residue - reballing will then take me longer as the balls will stick to the stencil and will need to be guided into the holes by a toothpick or sharp blade.

[vlt]

Re: Reballing HP G62 Intel ATI HD5470

What would be the best universal stencil to match that vga (Mobility HD5470) contacts drawing?

[gcomputers]

Re: Reballing HP G62 Intel ATI HD5470

There are two kinds of stencils. Direct heat and indirect heat. I use the direct heat stencils so the stencil stays in place when soldering the balls to the chip, it comes off afterwards.

With the indirect heat type, the stencil is lifted first and then heat is applied. But since i use a hot air station for soldering the balls to the chip, i must use the direct heat type, otherwise the air will move the balls towards each other and make a big mess.

Indirect heat stencils can only be used with a IR station or a hot plate.

Good job , but i give you an advice , if you look the chip after become brown because you use hot air to solder the balls to the chip, even before i used hot air , but now i use hot plate like (Honton 1212) and the solder process is more rapid and the chip remains the same without burning (green) .
Another advice not from me but from Amtech is the preheat process up to the temperature 140 grade C.

I really like Reballing ,i have suffered too much with BGA
at the beginning , i could not sleep thinking about it until just now don t have more problems with it .

[Th3_uN1Qu3]

Re: Reballing HP G62 Intel ATI HD5470

Thanks for the tip, but this works good enough for me. Although i do have a hot plate so i could give it a shot i guess. Laptop's still working btw, got in touch with the owner a few days ago.

[dj_ricoh]

Re: Reballing HP G62 Intel ATI HD5470

Good job , but i give you an advice , if you look the chip after become brown because you use hot air to solder the balls to the chip, even before i used hot air , but now i use hot plate like (Honton 1212) and the solder process is more rapid and the chip remains the same without burning (green) .
Another advice not from me but from Amtech is the preheat process up to the temperature 140 grade C.

I really like Reballing ,i have suffered too much with BGA
at the beginning , i could not sleep thinking about it until just now don t have more problems with it .

Whats that white thing from the plate?

[gcomputers]

Re: Reballing HP G62 Intel ATI HD5470

It s some kind of thermal cloth (like kitchen paper for oven). It usually comes with the hot plate when you buy it.

[Th3_uN1Qu3]

Re: Reballing HP G62 Intel ATI HD5470

Btw, just checked the pictures and that is a nvidia GPU from the affected lot. You do know that reballing those is useless, right?

[ktmmotocross]

Re: Reballing HP G62 Intel ATI HD5470

hot plate is good but upsidedown. why heating ic from chip when u can heat it from balls