Hi All,
Just wanted to see if I can get some advice on techniques and equipment I should use to try replace the socket on a Gigabyte H610M h v2ddr4 I have.
I was planning on using a heat mat I have that's used for phone, tablet screens, as a base heater than use hot air with a square nozzle on top. Yes I should get a proper preheater but I'm not in the position to go spend 300+ bucks on something I will use every 6 months if I'm lucky. Next expense I need to get is a decent programmer like the RT809H but again it would get used infrequently so hard to justify.
Questions:
1: I noticed another thread has a socket replacement guide from ASUS which recommends placing 2x4 wood blocks on the each side to stop the board from warping, is this still required on smaller MATX boards?
2: Since I'm using the heat pad is it still recommended to ramp your hot air temperatures slowly? Say starting at 200 and ramping 50c every 30 seconds? Trying to mimic heat profiles on BGA rework station.
3: The sockets I've ordered still have the protection cover on them. I was planning to leave them on to provide heat protection to the socket, and also apply some aluminum tape to the top again for the same purpose. Thoughts? Just covering the top not the sides otherwise I'll likely to stick to the board and end up with ball squeezage. I'm concerned the top cover may melt slightly and deform making it difficult to take off once the sockets installed.
Any other things I should take into consideration?
Thanks for the advice!
Just wanted to see if I can get some advice on techniques and equipment I should use to try replace the socket on a Gigabyte H610M h v2ddr4 I have.
I was planning on using a heat mat I have that's used for phone, tablet screens, as a base heater than use hot air with a square nozzle on top. Yes I should get a proper preheater but I'm not in the position to go spend 300+ bucks on something I will use every 6 months if I'm lucky. Next expense I need to get is a decent programmer like the RT809H but again it would get used infrequently so hard to justify.
Questions:
1: I noticed another thread has a socket replacement guide from ASUS which recommends placing 2x4 wood blocks on the each side to stop the board from warping, is this still required on smaller MATX boards?
2: Since I'm using the heat pad is it still recommended to ramp your hot air temperatures slowly? Say starting at 200 and ramping 50c every 30 seconds? Trying to mimic heat profiles on BGA rework station.
3: The sockets I've ordered still have the protection cover on them. I was planning to leave them on to provide heat protection to the socket, and also apply some aluminum tape to the top again for the same purpose. Thoughts? Just covering the top not the sides otherwise I'll likely to stick to the board and end up with ball squeezage. I'm concerned the top cover may melt slightly and deform making it difficult to take off once the sockets installed.
Any other things I should take into consideration?
Thanks for the advice!
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