Macbook A1466 820-3437-A no green light and fan speed full

[mon2]

Re: Macbook A1466 820-3437-A no green light and fan speed full

Use low heat and peel that off.

[Paul20]

Re: Macbook A1466 820-3437-A no green light and fan speed full

What temperature is recommended in this case for reflow.
If I can I'll try tomorrow with peace of mind.

[mon2]

Re: Macbook A1466 820-3437-A no green light and fan speed full

They call this 'underfill'.

I would start with a low temp like 150 C and low air pressure and go around in circles till this underfill starts to change some color. It will get crispy / soft and you should be able to flick it away after a bit of work. If required, increase the temp and air pressure but not enough to melt the solder BGA balls that are under this device.

The underfill will in the corners from my past experience.

Once you have done this -> flux around the perimeter of this IC.

Then increase the temp and air flow and keep applying the heat in circles over the top surface of the IC. The balls will eventually melt and the IC will sink down.

If this is a first time doing this, best to practice on a donor board.

Once the chip is hot and with melted balls -> gently, very gently push a corner (X & Y side) with tweezers. This will then push the entire chip away from the landing pads a very small amount and then let go immediately.

This will then allow the chip to bounce back to their natural resting spots. This process rebuilds the solder bonds with the PCB.

Louis calls it, 'make it dance so the solder balls align like soldiers'. Works very well and will fix any crappy connections that you cannot see for the SMC.

Proceed with caution as you can make a bigger mess than what is there now and then the BGA pads must be fluxed and cleaned -> then made flat -> then the SMC must be reballed and soldered back on.

Many YT videos on reballing and replacing the SMC.

Practice with your donor board and your equipment to get comfortable before starting.

[piernov]

Re: Macbook A1466 820-3437-A no green light and fan speed full

This is edge bonding (or corner bonding when it's only in the corners) and can be removed easily as it doesn't go under the component (or only very slightly but can still be pulled out). It needs to be removed otherwise the balls will get deformed and won't flow properly.
Underfill goes under the component, you cannot reflow components with underfill, you'd need to take them of and reball them.

[Paul20]

Re: Macbook A1466 820-3437-A no green light and fan speed full

They call this 'underfill'.

Here I am again, I took a couple of days to do everything calmly.
Over time I've seen quite a few videos about reballing and reflow, and I've already tried a few, so I'm not really at zero in this respect.
Anyway I ran the reflow, I waited for the pond to melt, then I lightly touched first one corner and then another of the chip, this one floated on the balls, I think I performed the procedure correctly, but the situation is not changed, always the same situation.

[Paul20]

Re: Macbook A1466 820-3437-A no green light and fan speed full

This is edge bonding (or corner bonding when it's only in the corners) and can be removed easily as it doesn't go under the component (or only very slightly but can still be pulled out). It needs to be removed otherwise the balls will get deformed and won't flow properly.
Underfill goes under the component, you cannot reflow components with underfill, you'd need to take them of and reball them.

Maybe I understand what you mean, and that is that in any case the innermost spheres may not undergo changes.
So it would be ideal to reball the whole chip, if I understand correctly.
I don't think I have a suitable stencil, so I would have to buy one resulting in waiting before receiving it, and despite this, there is always to understand if this will solve the situation, or the problem is elsewhere.
If there's a good chance that with a reballing the situation could change, it may be worth a try, I think.
But I don't want to risk doing this unnecessarily.