Hi,
I just got a LeFavor 858 heat gun today. I bought it for re-flowing a 1"x1" chip. I played around with it and find it difficult to get the right flow rate, nozzle size, and temperature for the job.
The main difficulty is not knowing when does the solder melt under the chip. Unlike removing the chip, I cannot keep pushing it until it moves. If it moves, I will never be able to put it back.
Is this the right tool for the job?
I do have an old toaster oven.
I just got a LeFavor 858 heat gun today. I bought it for re-flowing a 1"x1" chip. I played around with it and find it difficult to get the right flow rate, nozzle size, and temperature for the job.
The main difficulty is not knowing when does the solder melt under the chip. Unlike removing the chip, I cannot keep pushing it until it moves. If it moves, I will never be able to put it back.
Is this the right tool for the job?
I do have an old toaster oven.
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