Hi all,
Very frequently (at least 1/2 the time) when I do motherboard SMD soldering (eg ceramic caps, SOP-8 packages) I seem to pull the pads off when I lift the part, even though the solder appears to be nice and fluid.
I use a cheapo 20W soldering iron, flux paste, leaded solder, desolder braid. When I try and desolder a SOP-8 for example, I usually lift the legs on one side by running a cocktail stick into the 'groove' behind them, but there always seems to be a pad come off with them.
Does anyone have any idea what I'm doing wrong? Is my soldering iron temp too low? Should I buy a temp-controlled iron, or maybe some sort of hot air gun?
Thanks
Very frequently (at least 1/2 the time) when I do motherboard SMD soldering (eg ceramic caps, SOP-8 packages) I seem to pull the pads off when I lift the part, even though the solder appears to be nice and fluid.
I use a cheapo 20W soldering iron, flux paste, leaded solder, desolder braid. When I try and desolder a SOP-8 for example, I usually lift the legs on one side by running a cocktail stick into the 'groove' behind them, but there always seems to be a pad come off with them.
Does anyone have any idea what I'm doing wrong? Is my soldering iron temp too low? Should I buy a temp-controlled iron, or maybe some sort of hot air gun?
Thanks
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