I have had the BGA reflowed now, without stencil.
When I asked the guy who was going to do the work which of the three stencil variants I should choose, he offered to do the work without a stencil instead.
To just do it by hand, he fixes a lot of PS4s that way he says.
I wonder why he sent me looking for stencils if he doesn't need them, but he did the reflow for me for free, so I guess it's fine then.

By the way, the Ebay-seller on the link above, he also has the processors for sale if anyone needs them.
Presumably he ships them "pre-balled" even, maybe ask him if you need a processor.
The TV works after the reflow!
There is a massive amount of data from TXD-SERVICE at boot-up now, both with and without SDM enabled.
There's so much even that the UART apparently overflows the buffer and after a few seconds the serial output seems bitshifted.

I first started the TV without the heatsink attached, just for a few seconds before I unplugged the power again.
The Fusion processor became very hot!
Don't run the TV without the heatsink attached!
With the heatsink in place, I was able to operate the TV and enter the service menus.
It's already running the latest version so no upgrade was needed.
I made USB backups of all the settings from SAM, and also took the CSM-backup and CSM-extended dump for good measure, as well as the channel settings which can also be backed up to USB.
The reflow guy pointed out to me that there are two heatsink mounting holes diagonally across the Fusion chip at 55mm distance (it's actually 54.6mm to be specific), and that it is a standard form factor:
There are heatsinks available in that form factor, both with and without fan:
https://www.google.com/search?tbm=is...eatsink+54.6mm
Most of them seem to be pretty low profile, but something like this looks appropriate:
There will be some Dremel-related field surgery applied to the back chassis, similar to what Alpengeist did.
I also want to do my own backup of the NAND-content at this time, so I desoldered the NAND TSOP48 with the hot air station.
First I taped the surroundings with Kapton and added some flux to the pins, then I used the smallest nozzle at 400C.
It was very quick work, less than 30 seconds:
However, it turns out that the Micron MT29F8G08ABABA chip is not currently supported by the XGecu TL866II Plus.
The chip passed the "pin detection", but the programmer only supports the chip series up to MT29F4, where the last "4" signifies 4 Gbit size.
The Device ID from the chip comes back as 0x2C38 in the programmer software.
I sent an email to XGecu about it, maybe they'll add support in a future release.
As for now, I'll see tomorrow if the reflow guy has a more advanced programmer and can dump the chip for me.
Preferably I would had wanted to replace the NAND-chip right away because of the warnings during boot, but I couldn't find new chips in stock anywhere and one place listed 16 weeks as lead time.
So I'll just run this chip until it fails, and deal with the replacement if and when that time comes.

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