I'm working on another Lenovo E14 gen 2 AMD here which has a ton of errors with the factory soldered DDR4 ram chips. I do have a donor board here from which I'd like to use the modules and swap them. Unfortunately, the modules are glued down with underfill, which i have never worked with before.
I tried with a lot of heat on the donor board but the modules won't come loose.
Are there any hint or tricks when it comes to dealing with underfilled chips/ic that could help here
Thanks
Ongo
I tried with a lot of heat on the donor board but the modules won't come loose.
Are there any hint or tricks when it comes to dealing with underfilled chips/ic that could help here
Thanks
Ongo