Hello All!
I am very happy I found this forum! I am at a site with 100+ systems that are using the MSI MS-6337 Lite 815EP PRO VER:3 motherboards, some of which are freezing. The tech that was here before me had replaced many motherboards under warrenty, then started paying $75 bucks a board to have them replaced. (I now see that the replacement boards were never recapped, just replaced with another new board with the same bad caps) When I got here I replaced 5 motherboards in 3 months at the increased price of $85 a board, so I started to search for a reason these boards were going bad. I saw the caps had popped and figured that something was causing them to go, I never dreamed it was the caps themselves!
Anyway, I want to take a stab at recapping the boards. The caps are:
Chhis HK (M) 1000 uF 6.3v 8mm x 14mm (d x h)
TEAPO SM105°C 04/01 A3 1800 uF 16v 10mm x 30mm (d x h)
A few boards have G-Luxon 1000uF 6.3v 8mm x 14mm (d x h)
The Chhiss and G-Luxons are the ones I see popped the most. Once in a while I see the TEAPOs with a bit of crust on top.
I have a few questions:
1. If I see one cap burst should I do them all?
2. I'm having problems finding the 1800 uF 16v caps. Is there a different value I can use?
3. I can find the 1000 uF caps, but the different series have me very confused. How do I tell which will work for me?
4. I read here in the forums on a board similar to mine that the 1000uF 8 mm caps can be replaced with 10 mm with no problems, except for the 2 near the north bridge chip. Why is that and can I use the 10mms or do I need 8s?
5. I'm not clear on what type of desoldering tool to use. Other than desoldering braids the only kind I am familiar with are the ones that are like a plunger that quickly retract, creating a vacuum. Are these the bad kind and if so what are better?
Thanks!
I am very happy I found this forum! I am at a site with 100+ systems that are using the MSI MS-6337 Lite 815EP PRO VER:3 motherboards, some of which are freezing. The tech that was here before me had replaced many motherboards under warrenty, then started paying $75 bucks a board to have them replaced. (I now see that the replacement boards were never recapped, just replaced with another new board with the same bad caps) When I got here I replaced 5 motherboards in 3 months at the increased price of $85 a board, so I started to search for a reason these boards were going bad. I saw the caps had popped and figured that something was causing them to go, I never dreamed it was the caps themselves!
Anyway, I want to take a stab at recapping the boards. The caps are:
Chhis HK (M) 1000 uF 6.3v 8mm x 14mm (d x h)
TEAPO SM105°C 04/01 A3 1800 uF 16v 10mm x 30mm (d x h)
A few boards have G-Luxon 1000uF 6.3v 8mm x 14mm (d x h)
The Chhiss and G-Luxons are the ones I see popped the most. Once in a while I see the TEAPOs with a bit of crust on top.
I have a few questions:
1. If I see one cap burst should I do them all?
2. I'm having problems finding the 1800 uF 16v caps. Is there a different value I can use?
3. I can find the 1000 uF caps, but the different series have me very confused. How do I tell which will work for me?
4. I read here in the forums on a board similar to mine that the 1000uF 8 mm caps can be replaced with 10 mm with no problems, except for the 2 near the north bridge chip. Why is that and can I use the 10mms or do I need 8s?
5. I'm not clear on what type of desoldering tool to use. Other than desoldering braids the only kind I am familiar with are the ones that are like a plunger that quickly retract, creating a vacuum. Are these the bad kind and if so what are better?
Thanks!
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