Good day folks. As embarrassing as it may seem, despite not being what you'd call a complete amateur at soldering, it's dawned on me that lately that I haven't been able to do good quality jobs on SMD QFP packages and each time I'm faced with one, I get filled with anxiety like I'm about to deliver this big massive speech in front of a crowd or something. The problem I'm having is one I'm sure everybody who's ever done this had at some point: I start off OK, but about half way through soldering a side of the package, or sometimes even sooner, I'd make this big friggin' blob of solder which ruins my whole work. Trying to get rid of it is also a complete nightmare: the solder simply won't spread across the leads - it just keeps blobbing like mercury. Soldering wick doesn't seem to make a huge difference, in fact it seems to make it worse, as I sometimes bend the leads of the IC with it...so goddamn annoying. To add insult to injury, my workmate is able to solder these perfectly: even if he goes nuts and runs the tip back and forth over the leads repeatedly with complete disregard, he never seems to make a SINGLE blob of solder, whereas if I were to do that, it'd end up looking like the tab of a TO-220 package, instead of individual pins
. Aside from being a matter of sheer skills, I know, me and him don't use the same soldering station: while they are virtually identical, his tip is conical and rather long and sharp, whereas mine is sharp also but pretty stubby and "fat"....go ahead and criticize me all you want, oh yee solder pros out there, but what's actually the cause of solder bridges ? The flux I'm using or the tip ? Another thing I noticed is that his tip is slightly more oxidized and gray in color and it doesn't seem like the solder actually sticks to it, which might explain why he's able to drag it like a maniac over even the smallest leads and not get any joints, whereas mine is shiny and silver from the solder I always coat it with, so what's going on here ? Should I NOT tin it for this purpose ? Seems I can't solder anything smaller than SOICs with it without running joints everywhere - maybe it's too fat :| I haven't taken his tip for a spin yet (sounds wrong, I know), but I WILL have a go on an old Samsung board which has plenty of those QFPs for me to ruin and see if it's just me that sucks or the tip.

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