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Simple Continuity Testing?

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    Simple Continuity Testing?

    I have several Abit KT7 RAID boards. I recapped one and it works very well. It was my first recap, and encouaraged me to recap two more KT7s.

    One powers up, no post. The other does not power up.

    If I use my digital meter, can I just follow traces and isolate a "broken point" using the OHMS function. Does this work at all, or might it damage the board further?

    If a no-go, how do you islolate opens or shorts. Is there a simple way?

    #2
    Re: Simple Continuity Testing?

    If you're just looking for a broken trace use the continuity function on a meter. The audible beep gives you instant confirmation of a good trace so you can quickly move on.

    If electronic components will be inline between the points you are measuring you'll want to use the resistance function since the continuity buzzer may not beep if the resistance is over a certain threshold.

    Finding broken traces is never easy and is time consuming hopefully most of the time the failing part of the circuit gives you a ballpark area to look for damage.

    Motherboards utilize many board layers sandwiched on top of each other. If you think a double layer board is complex a motherboard has many more layers. It goes etched copper layer (traces), insulator layer, copper layer, insulator layer, etc. With vias connecting the inner and outside layers (the ones you can see on the top and bottom) together.

    Sometimes the only connection from these inner layers is the through hole the cap connects to. If the through hole was torn during cap removal the board is shot. There is no way to tap into that inner layer or trace where it went to. Sometimes filling the through hole with solder during cap installation MAY reconnect to the damaged layer sometimes not. It depends on the severity of the damage.

    If the cap connected solely to an outer layer you may be able to save the board with a wire jumper even then it's a crap shoot if the board will work since there may still be inner layer connections damaged.
    Last edited by Krankshaft; 11-02-2010, 10:53 AM.
    Elements of the past and the future combining to make something not quite as good as either.

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