TE Circuit Protection offers the widest selection of surface-mount fuses available for addressing a broad range of overcurrent protection applications. Helping to prevent costly damage and promote a safe environment for electronic and electrical equipment, our single-use chip fuses provide performance stability to support applications with current ratings from .5A up to 20A.
TE Circuit Protection also offers the telecom FT600 fuse for telecommunications applications. This telecom fuse helps comply with North American overcurrent protection requirements, including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68), and UL60950 3rd edition.
Multi-layer Design for Chip Fuses The multi-layer design has the benefit of exposing more fuse element surface area to the glass-ceramic absorption material.
When the fuse elements open, there is more material for the vaporizing fuse metals to absorb into, resulting in a very efficient and effective quenching of the fuse arc.
See datasheet figure 1 compared the multi-layer design of our SFF fuses with standard glass coated designs. The glass coated designs rely on the coating on only one side of the fuse element to absorb the vaporizing fuse material when it opens. Therefore, there is much less absorption material available to absorb the fuse metals. The result can be prolonged arcing and possible coating breach.
See datasheet figure 2 shows how the absorption characteristics of the two designs differ. The multi-layer design indicates a clean separation with the fuse element evenly diffusing into the surrounding ceramic substrate. In the glass coated design, the element diffusion takes place in a small portion of the device and is only absorbed by the glass material directly above the area of failure.
Wire-In-Air Design for 2410SFV Fuses The 2410(6125) is a Wire-In-Air SMD Fuse which is very suitable for secondary level over current protection applications.
Figure 3 compared our straight wire element design 2410SFV fuses with normal corrugating wire design fuse. The straight wire element in air performs consistent fusing and cutting characteristics together with excellent inrush current withstanding capability.
Introduced PCB assembly technology into 2410SFV fuses design and manufacture, we achieved on lead free completely and no end cap falling off risk comparing with traditional ceramic body with end cap fuse.
Temperature Derating A fuse is a temperature sensitive device. Therefore, operating temperature will have an effect on fuse performance and lifetime.
Operating temperature should be taken into consideration when selecting the fuse current rating. The Thermal Derating Curve for surface mount fuses is presented in Figure 4. Use it to determine the derating percentage based on operating temperature and apply it to the derated system current.
Pulse Cycle Derating Once the I2t value for the application waveform has been determined, it must be derated based on the number of cycles expected over the system lifetime. Since the stress induced by the current pulse is mechanical in nature, the number of times the stress is applied has significant bearing on how much derating must be applied to the fuse rating. Figure 5 presents the current pulse derating curve for our surface-mount chip fuses up to 100,000 cycles.
Selecting Surface-mount Fuses Fuse selection seems straightforward, in that, you pick one which has a current rating just a bit higher than your worstcase system operating current. Unfortunately, it's not that simple. There are derating considerations for operating current and application temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current surges or spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as simple as knowing the nominal current drawn by the system.
Surface-mount Fuses Pulse Tolerant Chip Fuses Pulse Tolerant chip fuses has high inrush current withstand capability and provide overcurrent protection on DC power systems. Silver fusing element, monolithic and multilayer design provides strong arc suppression characteristics.
These RoHS-compliant surface-mount devices facilitate the development of more reliable, high performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics.
Benefits
• High inrush current withstanding capability
• Ceramic Monolithic structure
• Silver fusing element and silver termination with nickel and tin plating
• Excellent temperature stability
• Strong arc suppression characteristics
Features
• Lead free materials and RoHS compliant
• Halogen free (refers to: Br900ppm, Cl900ppm, Br+Cl1500ppm)
• Monolithic, multilayer design
• High-temperature performance
• -55°C to +125°C operating temperature range
Applications
• Laptops
• Digital cameras
• Cell phones
• Printers
• DVD players
• Portable electronics
• Game systems
• LCD monitors
• Scanners
TE Circuit Protection also offers the telecom FT600 fuse for telecommunications applications. This telecom fuse helps comply with North American overcurrent protection requirements, including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68), and UL60950 3rd edition.
Multi-layer Design for Chip Fuses The multi-layer design has the benefit of exposing more fuse element surface area to the glass-ceramic absorption material.
When the fuse elements open, there is more material for the vaporizing fuse metals to absorb into, resulting in a very efficient and effective quenching of the fuse arc.
See datasheet figure 1 compared the multi-layer design of our SFF fuses with standard glass coated designs. The glass coated designs rely on the coating on only one side of the fuse element to absorb the vaporizing fuse material when it opens. Therefore, there is much less absorption material available to absorb the fuse metals. The result can be prolonged arcing and possible coating breach.
See datasheet figure 2 shows how the absorption characteristics of the two designs differ. The multi-layer design indicates a clean separation with the fuse element evenly diffusing into the surrounding ceramic substrate. In the glass coated design, the element diffusion takes place in a small portion of the device and is only absorbed by the glass material directly above the area of failure.
Wire-In-Air Design for 2410SFV Fuses The 2410(6125) is a Wire-In-Air SMD Fuse which is very suitable for secondary level over current protection applications.
Figure 3 compared our straight wire element design 2410SFV fuses with normal corrugating wire design fuse. The straight wire element in air performs consistent fusing and cutting characteristics together with excellent inrush current withstanding capability.
Introduced PCB assembly technology into 2410SFV fuses design and manufacture, we achieved on lead free completely and no end cap falling off risk comparing with traditional ceramic body with end cap fuse.
Temperature Derating A fuse is a temperature sensitive device. Therefore, operating temperature will have an effect on fuse performance and lifetime.
Operating temperature should be taken into consideration when selecting the fuse current rating. The Thermal Derating Curve for surface mount fuses is presented in Figure 4. Use it to determine the derating percentage based on operating temperature and apply it to the derated system current.
Pulse Cycle Derating Once the I2t value for the application waveform has been determined, it must be derated based on the number of cycles expected over the system lifetime. Since the stress induced by the current pulse is mechanical in nature, the number of times the stress is applied has significant bearing on how much derating must be applied to the fuse rating. Figure 5 presents the current pulse derating curve for our surface-mount chip fuses up to 100,000 cycles.
Selecting Surface-mount Fuses Fuse selection seems straightforward, in that, you pick one which has a current rating just a bit higher than your worstcase system operating current. Unfortunately, it's not that simple. There are derating considerations for operating current and application temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current surges or spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as simple as knowing the nominal current drawn by the system.
Surface-mount Fuses Pulse Tolerant Chip Fuses Pulse Tolerant chip fuses has high inrush current withstand capability and provide overcurrent protection on DC power systems. Silver fusing element, monolithic and multilayer design provides strong arc suppression characteristics.
These RoHS-compliant surface-mount devices facilitate the development of more reliable, high performance consumer electronics such as laptops, multimedia devices, cell phones, and other portable electronics.
Benefits
• High inrush current withstanding capability
• Ceramic Monolithic structure
• Silver fusing element and silver termination with nickel and tin plating
• Excellent temperature stability
• Strong arc suppression characteristics
Features
• Lead free materials and RoHS compliant
• Halogen free (refers to: Br900ppm, Cl900ppm, Br+Cl1500ppm)
• Monolithic, multilayer design
• High-temperature performance
• -55°C to +125°C operating temperature range
Applications
• Laptops
• Digital cameras
• Cell phones
• Printers
• DVD players
• Portable electronics
• Game systems
• LCD monitors
• Scanners