DFN and TDFN package differences and compatibility

[electrocute]

Hello. I've a noob question.
For same component model, are DFN (dual-flat no-leads) and TDFN (thin dual-flat no-leads) packages compatible? What are the differences, only the thickness/thinness? Is there a package format listing with such details (DFN and other types of component packages)?

I found some list on Wikipedia and some drawings/photos on datasheetdir but without specifying the differences.

Thanks in advance.

[mon2]

Re: DFN and TDFN package differences and compatibility

Hi. Yes.

TDFN = will be the thinner version of the standard DFN so will be a lower height on the component.

If possible, please share the part # and/or datasheet for more details. Often the datasheets will share a mechanical diagram for the proper pick & place placement equipment for the automated assembly. There it is critical that the parts have the proper height defined in the CAD tool. We have had this issue recently where our SMT head was turning on the vacuum to pick the part but we had the improper height definition so it was not creating the proper pressure to pick up the part. Kind of a gentle kiss to the top of the part and skipped to the next part on the tray feeling the part was not there. Chaos.

Be sure to compare the pin to pin pitch dimension as well as the X & Y values. In general, only the height will be different.

[electrocute]

Re: DFN and TDFN package differences and compatibility

The part is APL3523AQBI-TRG_TDFN14_2X3 (Datasheet).

I transplanted one from 330S_KBL_MB_V09 board to NM-A381 (see attached pictures, AFAIK they are the same). Still waiting for another part before testing it.

The questions comes from wanting to buy the part for later use on 330S_KBL.

[mon2]

Re: DFN and TDFN package differences and compatibility

Yes, the 2 parts look to be drop-in equivalents. Personally would select the TI branded part for such repairs.

[electrocute]

Re: DFN and TDFN package differences and compatibility

Funny to see a failing component on the changelog/revisions for cutting costs (attached image).

[mon2]

Re: DFN and TDFN package differences and compatibility

I will bet that they started with TI (real branded; properly tested & qualified design) -> then used the offshore (their local) clone of the above to lower the costs. Happens all the time.

To be honest, cannot paint everyone with the same dirty paintbrush. There are good quality manufacturers offshore but you have to do your homework to find them. We deal with numerous very high end suppliers (direct factory) for our PCBs; ESD & EMI parts for our designs. The same parts are 5-10x the costs under the private label in the USA / Canadian markets. The CEO did not want to discuss the 'private labelled' parts due to the margins they must be making and also non-disclosure agreements.

One IC we use in high volume is < $2 USD in Taiwan yet about $15 USD in North America. Multiply that by 10k-50k buys = new cars ; homes. Greed in the resellers market.