Hi friends, I have a Lenovo E14 Gen 2 Type 20TA laptop with serial number MJ-0GWZSZ TYPE 20TA-002CUS. Intel Core ™ i5-1135G7. It has Winbond 25R256JVEQ BIOS which has black epoxy resin. I have 2 questions. What method do you use to remove the epoxy? and the second, what chip do you use to program it if you have the TL866 II Plus programmer? Thanks in advance.
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I believe you may be referencing the wrong flash onboard. Hunt around for another similar flash device. This pic is of a Winbond W25R256 which is a secure flash device with a replay protection counter feature. Do not believe that you will be able to properly program this device. Wait on others to comment but there should be another standard flash bios onboard.
For the epoxy, low heat (100-150C) should allow this compound to become brittle and flake off with tweezers. -
This is the worst part of Lenovo. They put this black glue on almost every chip nowadays.Earlier it was only under BGA chips but now even core ic has it.
This epoxy wont melt at temps suggested by mon2. You can use a glue cutter knife very carefully to remove the glue to some extent and then flux and hot air gun to lift it.
Be careful not to cut the trace on PCB.
I managed to remove a thinkengine chip in this way without damaging the PCB pads.Comment
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according to the schematics the W25R256JV is the only SPI flash on the board.
This black glue is called underfill. If you search for "underfill tools" you will get some tools that might help a little bit.Comment
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did you mean "what clip do you use"?Originally posted by javieromex View Post
It is advisable to remove the solder balls from the BIOS chip beforehand, otherwise you will bend the pins on the clip.Comment
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