Best way to unsolder wson Macromix chip from HP 820 G3

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  • m2farid
    Member
    • Dec 2021
    • 32
    • France

    #1

    Best way to unsolder wson Macromix chip from HP 820 G3

    Hi all,

    I have trouble to unsolder macromix wson chip from hp 820 g3 and i have already damaged 2 bios cheap and i can`t still not succeed to unsolder them. My questions are:

    1. what is the best practice to unsolder these macromix wson chips?

    2. Is there a way to solder wire to the gold pad around the chip to this adatapter QFN8 /WSON8/MLF8/MLP8/DFN8 DIP8?
    https://ae01.alicdn.com/kf/Sd49b4e34...20xz.jpg_.webp

    My soldering station is PROSTORMER 8582D

    My programmer is Xgecu TL866II Plus

    I have the adaptor listed before

    I have a Test Probe Pogo for wson 6x5, but i can not read chip with it and the TL866II Plus, i have always pin detect error. Do you think that i need an adaptater for this?

    Many thanks for your help.

    Farid
    Last edited by m2farid; 03-14-2023, 06:06 PM.
  • dellxps15
    Badcaps Legend
    • Feb 2014
    • 1591
    • italy

    #2
    Re: Best way to unsolder wson Macromix chip from HP 820 G3

    hi what temperature and air flow and flux u use ?

    also what nozzle and what mainboard pcb type is it ?
    for most mainboard i use 387° celsius and airflow to 6 and nozzle around 10mm diameter.
    on hot air station generally there are 2 screw to set temperature. set them to reach max temperature.
    to unsolder that kind of component u have to stay here for around 120 seconds aat least when there is still lead free solder.
    for faster unsolder u can remove the nozzle and stay 1-2cm far from bios chip.

    always use flux for desolder and solder.
    once desoldered replace solder with leaded .

    Comment

    • mon2
      Badcaps Legend
      • Dec 2019
      • 14338
      • Canada

      #3
      Re: Best way to unsolder wson Macromix chip from HP 820 G3

      An underside pre-heater / infrared heater for the pcb is recommended as the logic board is very likely a 6-8 layer pcb design.

      We faced one from Asus that would not budge the bios chip with our Best 863 tool at full blast air and 550C setting.

      Since then we have purchased a Hakko heater (original) and also a complex bga rework station. The bga rework station has a large IR heater and can remove parts in under 3-4 minutes. Soon we will test to remove and replace CPU / PCH devices.

      Many low cost IR heaters with a small table for pcbs on AliExpress.

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