Re: time to ditch my $20 25w iron and get sumpin' REAL!!!
If the "goop" seals the cap to the board that junk would presumably need to be scraped off with a small tool like a Jeweler's screw driver before removing the cap anyway, and hopefully that would open an air path. Maybe not if the goop ran under the cap though. In any case, I have never seen goop on a motherboard, only on LCD inverter/PS boards.
For the caps that are tight down on the board, with no goop, but maybe leaked a little, when the desoldering tool is applied and the solder melted, if the cap is then tilted a bit, just slightly pulling the lead up out of the hole, shouldn't the air flow for the sucker be restored?
Somewhere or other I read a suggestion that one could pull the can off the cap, leaving just the leads. Seemed like a bad idea since it might make a mess or break traces, but if there was no other way to get the cap off, I suppose it could be the last resort, and it should restore air flow.
If the "goop" seals the cap to the board that junk would presumably need to be scraped off with a small tool like a Jeweler's screw driver before removing the cap anyway, and hopefully that would open an air path. Maybe not if the goop ran under the cap though. In any case, I have never seen goop on a motherboard, only on LCD inverter/PS boards.
For the caps that are tight down on the board, with no goop, but maybe leaked a little, when the desoldering tool is applied and the solder melted, if the cap is then tilted a bit, just slightly pulling the lead up out of the hole, shouldn't the air flow for the sucker be restored?
Somewhere or other I read a suggestion that one could pull the can off the cap, leaving just the leads. Seemed like a bad idea since it might make a mess or break traces, but if there was no other way to get the cap off, I suppose it could be the last resort, and it should restore air flow.
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