I have worked on hundreds of xbox 360 mainboards and have seen many come back from Microsoft Repairs with Caps Changed.
Does anyone know if there are certain caps in the Xbox 360 that are prone to failure and should be replaced by default?
OR
is Microsoft just removing caps and plastic ports so they can oven rework/reflow boards?
I am well aware of the problems with the cracked leadfree solder and I have a computer controlled rework machine to repair the boards and sometimes reball the chips.
However this is sometimes not enough to keep system from returning to red ring error even when xray's show no cracked or bridged solder points.
I also see that Microsoft sometimes changes the values of the caps from board to board Some have bank of 6.3v 1500uf capacitors and others have bank of 6.3v 2200uf caps.
Its too much time to try and test each and all the caps on each board. not enough money in repairs to justify the time. however if there were say a few or even a bank that was known to fail or improve reliability with changed value. Then it may be worth just changing them in the process of reworking board.
Even though there is only one other post on this forum about xbox 360's, I posted here because most people on gaming related forums have no electronics training what so ever and spout nothing but BS about xclamps and towel tricks.
I am hoping for a more educated answer to the reason why Microsoft seems to always change caps when they work on boards and should I consider such an extreme approach to repairing xbox 360's.
Any thoughts anyone?
Sincerely, Magna
Does anyone know if there are certain caps in the Xbox 360 that are prone to failure and should be replaced by default?
OR
is Microsoft just removing caps and plastic ports so they can oven rework/reflow boards?
I am well aware of the problems with the cracked leadfree solder and I have a computer controlled rework machine to repair the boards and sometimes reball the chips.
However this is sometimes not enough to keep system from returning to red ring error even when xray's show no cracked or bridged solder points.
I also see that Microsoft sometimes changes the values of the caps from board to board Some have bank of 6.3v 1500uf capacitors and others have bank of 6.3v 2200uf caps.
Its too much time to try and test each and all the caps on each board. not enough money in repairs to justify the time. however if there were say a few or even a bank that was known to fail or improve reliability with changed value. Then it may be worth just changing them in the process of reworking board.
Even though there is only one other post on this forum about xbox 360's, I posted here because most people on gaming related forums have no electronics training what so ever and spout nothing but BS about xclamps and towel tricks.
I am hoping for a more educated answer to the reason why Microsoft seems to always change caps when they work on boards and should I consider such an extreme approach to repairing xbox 360's.
Any thoughts anyone?
Sincerely, Magna
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