Hi I have several very small components on some cell phone boards that have to be replaced (surface mount) and I think the best way to apply the part it is to use small drops of liquid solder paste and place the component down then heat it up with hot air nozzle but I am not sure what the best type of solder paste to use? Lead or lead free solder paste?
The stuff I got is no clean lead free OM-338 but I have to ordre more since my stuff is expired, but I was checking if lead solder paste would be better for my application?
The stuff I got is no clean lead free OM-338 but I have to ordre more since my stuff is expired, but I was checking if lead solder paste would be better for my application?
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