Having experimented on an old motherboard with different methods of removing solder from the plated through holes I finally decided to use my tried and tested solder sucker. The kind not recommended. I think mine is a little different to most, about 20years old and a small spring loaded aluminium device (not like a lot of the current large and powerful plastic jobs).
Using a Weller 700F tip and a technique shown in an illustration I would like to add but I have not been able to make the insert image work for this post.
So the method required using the soldering iron to heat the solder in the hole on the under side of the board and positioned so that the hole is at least half exposed, next place the solder sucker right over the top of the hole whilst the iron is still keeping hot then release the solder sucker. Make sure the soldering iron is in position longer enough so that all the solder will flow freely. This was a quick and successful method. But I did strike two troublesome holes and I used my PCB drill with a 0.8mm bit very effectively.
After removing the original solder I would first clean up excess solder flux with methylated spirits then insert the new component and solder.
Replaced 23 capacitors mostly with Rubucon ZL and some with a 8 mm diameter requirment have been replaced with Nippon LXZ. The system is going really well.
The board is an Epox 8RDA+
Using a Weller 700F tip and a technique shown in an illustration I would like to add but I have not been able to make the insert image work for this post.
So the method required using the soldering iron to heat the solder in the hole on the under side of the board and positioned so that the hole is at least half exposed, next place the solder sucker right over the top of the hole whilst the iron is still keeping hot then release the solder sucker. Make sure the soldering iron is in position longer enough so that all the solder will flow freely. This was a quick and successful method. But I did strike two troublesome holes and I used my PCB drill with a 0.8mm bit very effectively.
After removing the original solder I would first clean up excess solder flux with methylated spirits then insert the new component and solder.
Replaced 23 capacitors mostly with Rubucon ZL and some with a 8 mm diameter requirment have been replaced with Nippon LXZ. The system is going really well.
The board is an Epox 8RDA+
Comment