Well, what I was saying is that poor quality lead is a problem enough as far as thermal expansion and solder fracturing goes, but the total removal of lead from the solder (it is for a large part the quality of lead that determines how well such solder takes abuse!) means the end of taking any sort of flex that extreme temperature swings and levels would incur (good lead comprises of mostly tin and some silver, I believe). Tin whiskers are another problem. They were already an issue with leaded solder but with lead-free solder they will become a problem much sooner since lead inhibits their growth. I don't totally hate flat panels either, I just find it amusing how many times quicker they fail in comparison to good CRTs... of course, lots of that has to do with much less room to ventilate heat (and craptacular capacitors often used in those case), and the fact that CRTs are low frequency devices in comparison.
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