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The Recapping FAQ

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    #16
    Re: The Recapping FAQ

    I would like to suggest that a magnifying glass be added to the equipment list. Preferably at x10 magnification. This is used to check the quality of work before powering up the board. The most important to check are the vias that are surrounded by a copper plane (often an earth plane). So that there is certainty of no bridging solder.

    Better to check before causing a problem.
    Gigabyte EP45-DS3L Ultra Reliable (Power saver)
    Intel E8400 (3000Mhz) Bios temps. 4096Mb 800Mhz DDR2 Corsair XMS2 4-4-4-12
    160Gb WD SATAII Server grade
    Nvidia 8500GT 256Mb
    160Gb WD eSATAII Server grade for backup.
    Samsung 18x DVD writer
    Pioneer 16x DVD writer + 6x Dual layer
    33 way card reader
    Windows XP Pro SP3
    Thermaltake Matrix case with 430W Silent Power
    17" Benq FP737s LCD monitor
    HP Officejet Pro K5300 with refillable tanks

    Comment


      #17
      Re: The Recapping FAQ

      Some recap pictuers. I like the VRM layout of the 8RDA+ board. The output filter caps neatly close to the CPU. Pictures show the replacing of these caps with Rubicon MCZ, three replaced at a time. Photos are resized to 600 pixels. The focus is not always good, I need a small tripod.
      Attached Files
      Gigabyte EP45-DS3L Ultra Reliable (Power saver)
      Intel E8400 (3000Mhz) Bios temps. 4096Mb 800Mhz DDR2 Corsair XMS2 4-4-4-12
      160Gb WD SATAII Server grade
      Nvidia 8500GT 256Mb
      160Gb WD eSATAII Server grade for backup.
      Samsung 18x DVD writer
      Pioneer 16x DVD writer + 6x Dual layer
      33 way card reader
      Windows XP Pro SP3
      Thermaltake Matrix case with 430W Silent Power
      17" Benq FP737s LCD monitor
      HP Officejet Pro K5300 with refillable tanks

      Comment


        #18
        Re: The Recapping FAQ

        A few useful recap tips.

        1. When inserting the capacitor, hold it firmly against the motherboard and cut off both leads close to the surface (using a good, fine and sharp cutter) before soldering. This will enable the solder to flow over and down the cap leads making a neat finish as well. This in fact emulates the original soldering.
        2. When soldering is complete it is important to clean off all soldering flux. With the flux removed it will be possible to inspect (with a magnifying glass) the critical vias surrounded by earth plane. Any stray fine solder can then be identified and removed. To remove the flux use a stiff brush(toothbrush) and some methylated spirits and then clean/dry up with a lint free rag.
        Gigabyte EP45-DS3L Ultra Reliable (Power saver)
        Intel E8400 (3000Mhz) Bios temps. 4096Mb 800Mhz DDR2 Corsair XMS2 4-4-4-12
        160Gb WD SATAII Server grade
        Nvidia 8500GT 256Mb
        160Gb WD eSATAII Server grade for backup.
        Samsung 18x DVD writer
        Pioneer 16x DVD writer + 6x Dual layer
        33 way card reader
        Windows XP Pro SP3
        Thermaltake Matrix case with 430W Silent Power
        17" Benq FP737s LCD monitor
        HP Officejet Pro K5300 with refillable tanks

        Comment


          #19
          Re: The Recapping FAQ

          Getting a clean hole thru a via.
          A tip to improve sucking out some vias. If the first attempt clears say about half the hole there is a need to get flux into the hole to make the solder more mobile. This can be achieved best if you are using fine flux cored solder no larger in diameter than 0.7 mm. First insert the cold solder as far into the via as possible then apply the soldering iron to run flux and solder into the via. The solder in the hole will now suck out more readily and should leave a clean hole.
          Gigabyte EP45-DS3L Ultra Reliable (Power saver)
          Intel E8400 (3000Mhz) Bios temps. 4096Mb 800Mhz DDR2 Corsair XMS2 4-4-4-12
          160Gb WD SATAII Server grade
          Nvidia 8500GT 256Mb
          160Gb WD eSATAII Server grade for backup.
          Samsung 18x DVD writer
          Pioneer 16x DVD writer + 6x Dual layer
          33 way card reader
          Windows XP Pro SP3
          Thermaltake Matrix case with 430W Silent Power
          17" Benq FP737s LCD monitor
          HP Officejet Pro K5300 with refillable tanks

          Comment


            #20
            Re: The Recapping FAQ

            There are many good tips posted in this thread regarding recapping. You need to read the full process posted by Willawake to see the full equipment list and the alternate methods. You may then find the following tip can simplify the process.

            New Cap soldering.

            The most simple and efficient method is to cut a 6mm length of 0.7 – 0.8mm fluxed solder and bend it into a V shape (stops any prospect of rolling) before inserting the cap. Insert the cap, press the body against the board surface and cut the leads so that they are 0.5 – 1 mm above the board surface. Holding the cap in place pick up the 6mm length of solder and place it against one of the leads. Pick up the soldering iron and place it on the solder next to the lead. The solder will run into the via and one lead is now held. The remaining lead can soldered by placing the iron tip on the lead and feeding solder into the junction of the lead and soldering iron, this is much faster and more thermally efficient than having the iron and solder on opposite sides of the lead, making for a very quick solder time.

            Once soldering is completed the flux must be cleaned away and each via inspected for a prospective short with a magnifying glass, preferably x10. Methylated spirits and a tooth brush are two low cost flux removal tools. Finally clean up with a lint free rag moistened with meth.

            I hope you find this helpful.
            Last edited by willawake; 02-05-2006, 01:30 PM.
            Gigabyte EP45-DS3L Ultra Reliable (Power saver)
            Intel E8400 (3000Mhz) Bios temps. 4096Mb 800Mhz DDR2 Corsair XMS2 4-4-4-12
            160Gb WD SATAII Server grade
            Nvidia 8500GT 256Mb
            160Gb WD eSATAII Server grade for backup.
            Samsung 18x DVD writer
            Pioneer 16x DVD writer + 6x Dual layer
            33 way card reader
            Windows XP Pro SP3
            Thermaltake Matrix case with 430W Silent Power
            17" Benq FP737s LCD monitor
            HP Officejet Pro K5300 with refillable tanks

            Comment


              #21
              Re: The Recapping FAQ

              crkhed:
              The scribed marks in the top of caps are deliberate stress-relief markings so that when they explode they do so with less ferocity and in a semi-controlled manner. This is a standard technique in engineering. In hydrogen plant engineering the roofs are generally hinged! Upwards, that is....

              Comment


                #22
                Re: The Recapping FAQ

                i am updating with some pics as requested.
                capacitor lab yachtmati techmati

                Comment


                  #23
                  Re: The Recapping FAQ

                  Beautiful!
                  You didn't include an hairdryer/electric paint stripper to warm the board before attacking it with a soldering iron. Also a useful implement for removing smc ics and memory chips!

                  Comment


                    #24
                    Re: The Recapping FAQ

                    PS. Sometimes I use a fine drill bit in a hand chuck to clear the hole. Essential to use an undersize drill bit!

                    mod comment : this is not recommended. probably you will screw it up.
                    Last edited by willawake; 08-05-2006, 03:28 PM.

                    Comment


                      #25
                      Re: The Recapping FAQ

                      ...some very good information... thanks... parttimebill

                      Comment


                        #26
                        Re: The Recapping FAQ

                        Have found it useful over the years to ALWAYS photo document boards as well as diagram; just often enough being able to refer to a series of clear BEFORE pics from various angles will reveal some element that hadn't been covered in a diagram. Thanks to all for these excellent articles! (doing Abit VL6 project prep)
                        "Men occasionally stumble over the truth, but most of them pick themselves up and hurry off as if nothing ever happened. " Sir Winston Churchill (1874 - 1965)

                        Comment


                          #27
                          Re: The Recapping FAQ

                          Many thanks to Willawake for the sticky FAQ. I followed it verbatim, and my first recap job was a complete success.

                          Notable points in the FAQ are the temperature points for removal and replacement. I found the pin method for clearing the board holes worked best for me. I used some of my wife's dress making pins with a ball end for easy pushing.

                          Key point: be sure to clear the holes using the 450C temp setting. Lower than this doesn't work well at all.

                          Key point: flow new solder on to every lead you are going to remove. The FAQ is dead-on with this one. Worked great.

                          I used a Hakko 936 12/P with the standard small chisel tip. Solder was Kester 60/40.

                          Comment


                            #28
                            Re: The Recapping FAQ

                            I have been in electronics for over 40 years and the best way I found to clean out holes after removing a part is to use compressed air set at about 10 to 15 pounds. USE ONLY A LOW AIR PREASURE!!! THIS MUST BE DONE CAREFULLY!!. I hold the board vertically in a vice by putting some padding one the edge so I do not damage the board. I put a cut down box about a foot in back of the board. Wearing a glove on the hand with the soldering iron I heat the hole while at the same time I hold a blowgun one the other side of the hole. As soon as the solder is melted I press the button on the blowgun and quickly remove the iron. This blows all the solder out. The box collects the solder splatter and the glove protects my hand. CAUTION SHOULD BE USED AND SAFTEY GLASSES SHOULD BE WORN!!.

                            Comment


                              #29
                              Re: The Recapping FAQ

                              I wanted a recaping How-To that I could just print out, so I created a PDF document of The Recapping FAQ. But, it is too larg (1.7MB) for me to attach it to a post. I made the original on Linux using the OpenOffice Office Suite, but the OpenOffice document format of .odt is not an allowed file format.

                              So, OO will also save it as a MS Word document, so I attached that file here. It altered it a little, so I had to re-edit it.

                              Is there any way to get the PDF version added to the forum or badcaps web site? That is assuming you want to add it.
                              Last edited by willawake; 05-28-2008, 03:06 PM.

                              Comment


                                #30
                                Re: The Recapping FAQ

                                I see that the images weren't saved with the Word file. That is why a PDF file is better. I can't edit the last post anymore to remove the bad file.

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