Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

[fearnaboinne]

Hi all,

I have a Samsung TV (as above) with solarized image (See attached image)

I measured the test points (TV on, no inputs connected) on the T Con board (V400H1-C01), which sports an AS19-H1G, and they measure (from 1 - 17) as follows:
13,13V
11,67V
11,04V
10,46V <-- !
10,96V <-- !
10,56V
9,96V
7,69V
7,03V
6,46V
5,93V
4,47V
4,01V
3,64V
3,48V
4,53V <-- !
2,05V

Am I correct in diagnosing that the T Con has died, and specifically the AS19-H1G chip?

[flocko]

Re: Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

Yes these test results show the AS19 IC to have failed. the problem with this is the ICs are very hard to remove from the board without doing damage. As the back of the IC is bonded to T-Con board and no amount of heat seems to help.

[fearnaboinne]

Re: Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

Thanks for the confirmation... I've read about the 'challenges' these chips pose... Best I can do - I guess - is try to remove it, and see what happens... If it comes off, great, if not, I won't be off any worse, and will need to order a replacement board...

[Andrew F. Ali]

Re: Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

My advice is just go ahead and get a new T-CON replacement. Those AS15/19 chips are really difficult to replace unless you have the proper tools and correct procedure. I 've failed miserably at doing this job. Less headache is what I mean.

[mmartell]

Re: Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

I've been trying to lift one of these recently without luck but have not destroyed the board yet either. How is this ic "bonded" other than with the ground pad ?

My replacement AS19 is arriving tomorrow and I was about to let the big dog eat (paint stripper), maybe not such a good idea...

Someone else me tioned dremmeling down the ic - might be the way to go.

Anyone with knowledge on how the as19 is affixed to the board ?

[flocko]

Re: Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

The AS19-HIF is the larger 5.0x5.0mm IC and has an exposed pad that is soldered to the board, the AS19-HF is the smaller 3.5x3.5mm IC but also has the solder pad . to remove you need a good hot air station and lots of good quality no clean flux, pre heat the back of the board ,then using a small nozzle play the hot air on the centre of the IC, the heat will generate to the pad and pins. you should not need to heat to long before it will lift off don't force it, if it wont lift kept heating till it will

[mmartell]

Re: Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

I have the AS19-H1G, anything to note about that one ? Will try your suggestion.

[flocko]

Re: Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

AS19-HIF = lead free
AS19-HIG= green mode ? Just for production line soldering and makes them hard to get off

[mmartell]

Re: Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

I will still attempt to heat the center of the ic and will report back.

[mmartell]

Re: Samsung LE40A556P1FXXC (T-Con V400H1-C01) solarized image

Got it off but tore one of the corner pads off. Also when I first lifted it things didn't look quite right so I heated again and off came a "plate" that doesn't appear to be part of the ic. Didn't reinstall it.

Lost a couple resistors in the process so this is now in resurrection mode. I didn't write down the locations but will do so soon, maybe someone has one of these laying around that they can lift some measurements from.