Re: New Software Achi LY by PSOFT
What I say comes from my experience as a mid-level repairer (not the knowledge but the availability of equipment), unfortunately if you work with the final consumer and not with a company, the cost of the repair is of great importance. when making repairs for people who work with their own hardware, price is not of primary importance but speed and competence are.
In my opinion it is certainly preferable to rely on a well-known manufacturer (ERSA, and similar) who not use cheap materials, everything that is Chinese (Chinese manufacturers use European or US technology) is for those who do not have the money (me too) and want to save.
With the bga of recent years the popcorn is very rare while the distortion on the rectangular chips is a big problem. (intel SR32Q and similar)
for this reason I prefer to remove the bga from a donor card using a cnc
(cold method)
In mass production a lot of tests are done and a lot of cards have to be damaged to know the correct profile. Notebook cards are all different and this makes the job more complex
Without the use of an x-ray machine it is not possible to understand if the profile is correct.
This is to obtain a lasting weld over time and not just for an unknown time
The heat should be transmitted by radiation so the watts (in a certain range of values) are not very important than the frequency that the top heater generates . Each material absorbs heat in a different way, even the color has its importance , this with IR machines.
For this reason, even 150W is sufficient
As for other gases instead of air they are mainly used to avoid the generation of oxidation.
I have used some automatic bga machine and the welding process is not only faster but much more accurate
What bga solder machine you use ?
What I say comes from my experience as a mid-level repairer (not the knowledge but the availability of equipment), unfortunately if you work with the final consumer and not with a company, the cost of the repair is of great importance. when making repairs for people who work with their own hardware, price is not of primary importance but speed and competence are.
In my opinion it is certainly preferable to rely on a well-known manufacturer (ERSA, and similar) who not use cheap materials, everything that is Chinese (Chinese manufacturers use European or US technology) is for those who do not have the money (me too) and want to save.
With the bga of recent years the popcorn is very rare while the distortion on the rectangular chips is a big problem. (intel SR32Q and similar)
for this reason I prefer to remove the bga from a donor card using a cnc
(cold method)
In mass production a lot of tests are done and a lot of cards have to be damaged to know the correct profile. Notebook cards are all different and this makes the job more complex
Without the use of an x-ray machine it is not possible to understand if the profile is correct.
This is to obtain a lasting weld over time and not just for an unknown time
The heat should be transmitted by radiation so the watts (in a certain range of values) are not very important than the frequency that the top heater generates . Each material absorbs heat in a different way, even the color has its importance , this with IR machines.
For this reason, even 150W is sufficient
As for other gases instead of air they are mainly used to avoid the generation of oxidation.
I have used some automatic bga machine and the welding process is not only faster but much more accurate
What bga solder machine you use ?
Originally posted by xipxid
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