I've said before here that I've found MSI boards to be fairly tolerant of being poly-modded, and today, I did another one. A 945CGM5-F V2 to be exact.
The CPU VRM high got 470uF Nich LG 16V polies, while the low side got 820uF 2.5 OS-CONs.
The others which originally had 470uF either got that or 330uF as replacements
There were two 1500uF caps on the RAM VRM which were replaced with 820uF 6.3V Nichicon L8, and there were 3 220uF 10V caps near the chipset which were replaced with 220uF 6.3V NCC PSC.
Everywhere else (which originally had 1000uF 6.3V lytics) got either 1000uF or 820uF 6.3V Nichicon L8.
I was quite interested in doing this board as there is what appears to be a linear regulator in the 3rd picture here (in between the CMOS battery and DIMM slot), which gets very hot, and the lone cap immediately above it is usually the first to go on these boards. Hopefully, the poly will handle the heat a bit better.
The CPU VRM high got 470uF Nich LG 16V polies, while the low side got 820uF 2.5 OS-CONs.
The others which originally had 470uF either got that or 330uF as replacements
There were two 1500uF caps on the RAM VRM which were replaced with 820uF 6.3V Nichicon L8, and there were 3 220uF 10V caps near the chipset which were replaced with 220uF 6.3V NCC PSC.
Everywhere else (which originally had 1000uF 6.3V lytics) got either 1000uF or 820uF 6.3V Nichicon L8.
I was quite interested in doing this board as there is what appears to be a linear regulator in the 3rd picture here (in between the CMOS battery and DIMM slot), which gets very hot, and the lone cap immediately above it is usually the first to go on these boards. Hopefully, the poly will handle the heat a bit better.
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