Re: Replacing BGA components with hot air.
Would be nice if the manufacturers would put a BGA socket in so replacement would be a lot easier. It would cost a few cents more, but it would really be worth it until their boards have been proven. Meaning that the design and the manufacturing processes of the boards have less then a 1 % fall out over say a three year period. If they decided to go with a different manufacturer then the socket would go back into place. So a test component could easily be inserted to test the continuity of the contact points to the board. Perhaps by putting a signal on each point and measuring how long it takes to bounce back. Also, if one could heat the socket bad pin separately so the solder would re-flow. The socket material would have to be made out of a material what would allow that type of heat for a short time.
Would be nice if the manufacturers would put a BGA socket in so replacement would be a lot easier. It would cost a few cents more, but it would really be worth it until their boards have been proven. Meaning that the design and the manufacturing processes of the boards have less then a 1 % fall out over say a three year period. If they decided to go with a different manufacturer then the socket would go back into place. So a test component could easily be inserted to test the continuity of the contact points to the board. Perhaps by putting a signal on each point and measuring how long it takes to bounce back. Also, if one could heat the socket bad pin separately so the solder would re-flow. The socket material would have to be made out of a material what would allow that type of heat for a short time.
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