Chip-on-film (COF) is a new technology after tape-automated bonding (TAB) and chip-on-glass (COG) in the interconnection of liquid crystal module (LCM). The thickness of the film, which is more flexible than TAB, can be as thin as 44 μm. It has pre-test capability, while COG does not have. It possesses great potential in many product fabrication applications.In this study, we used anisotropic-conductive film (ACF) as the adhesive to bind the desired IC chip and polyimide (PI) film. The electric path was formed by connecting the bump on the IC and the electrode on the PI film via the conductive particles in the ACF. In the COF bonding process experimental-design method was applied based on the parameters, such as bonding temperature, bonding pressure and bonding time. After reliability tests of (1) 60 °C/95%RH/500 h and (2) C/500 cycles, contact resistance was measured and used as the quality inspection parameter. Correlation between the contact resistance and the three parameters was established and optimal processing condition was obtained. The COF samples analyzed were fabricated accordingly. The contact resistance of the COF samples was measured at varying temperature using the four points test method. The result helped us to realize the relationship between the contact resistance and the operation temperature of the COF technology. This yielded important information for circuit design.
Anisotropic conductive films (ACF) bonding was used to connect thin flexible cables to the mirror. ACF bonding is a commercially established approach for making electrical connections to liquid crystal display panels and other electronic packages. Custom ACF electrical cables were made with Cu traces spaced equidistant to the electrical contacts patterned at the mirror's axial edge Fig. 3(c). Each Cu trace was connected to the electrical contacts by using a bonding tool able to apply temperature and pressure with high precision. .
Mod-02 Lec-10 Wire bonding, TAB and flipchip-2; Tutorials
https://www.youtube.com/watch?v=vKj3eXgyC5c
COF (Chip-On-Film) Technology for LCD Driver ICs Using ... - Sharp
http://slideplayer.com/slide/5687749/release/woothee
Can we repair COF?
LC420DUE-FGA6 - BLANK SCREEN ISSUE IN LED PANEL, ONLY BACKLIGHT,
https://www.youtube.com/watch?v=-itHoG_GAhE
Anisotropic conductive films (ACF) bonding was used to connect thin flexible cables to the mirror. ACF bonding is a commercially established approach for making electrical connections to liquid crystal display panels and other electronic packages. Custom ACF electrical cables were made with Cu traces spaced equidistant to the electrical contacts patterned at the mirror's axial edge Fig. 3(c). Each Cu trace was connected to the electrical contacts by using a bonding tool able to apply temperature and pressure with high precision. .
Mod-02 Lec-10 Wire bonding, TAB and flipchip-2; Tutorials
https://www.youtube.com/watch?v=vKj3eXgyC5c
COF (Chip-On-Film) Technology for LCD Driver ICs Using ... - Sharp
http://slideplayer.com/slide/5687749/release/woothee
Can we repair COF?
LC420DUE-FGA6 - BLANK SCREEN ISSUE IN LED PANEL, ONLY BACKLIGHT,
https://www.youtube.com/watch?v=-itHoG_GAhE
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