Hey guys,
I recently tried to remove an SOC (dead) from a donor board for practice. It's my first SOC removal and desoldering process was uneventful. Once lifted, I did a visual inspection of same and everything looked OK.
I placed the SOC on a piece of ceramic to cool down (as I usually do when removing BGA) but when I went to clean it later, I noticed it was warped (please see attached picture). I never had this issue before with other BGA and thought it might be because of uneven cooling due to the shape of the SOC.
Initial 'solution' I thought of (assuming it is due to uneven cooling) is to place the SOC on a piece of Aluminium foil near the hot/bottom plate and let it cooldown slowly alongside the hot plate.
Note:
The deflection at maximum is around 0.6mm
Anyone ever had similar issue? If yes, what was your solution?
I recently tried to remove an SOC (dead) from a donor board for practice. It's my first SOC removal and desoldering process was uneventful. Once lifted, I did a visual inspection of same and everything looked OK.
I placed the SOC on a piece of ceramic to cool down (as I usually do when removing BGA) but when I went to clean it later, I noticed it was warped (please see attached picture). I never had this issue before with other BGA and thought it might be because of uneven cooling due to the shape of the SOC.
Initial 'solution' I thought of (assuming it is due to uneven cooling) is to place the SOC on a piece of Aluminium foil near the hot/bottom plate and let it cooldown slowly alongside the hot plate.
Note:
The deflection at maximum is around 0.6mm
Anyone ever had similar issue? If yes, what was your solution?
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