Hoping someone can give me some advice, i ve been using a hot air station for a few years now, no issues soldering ic's,mosfets,transistors. Im going to be soldering a surface mount 48 pin chip to a main board for a repair. Ive been practicing on faulty boards and cant seem to get the solder to flow to each individual pin without clumping the pins together. Im using low temp solder paste, rosin solder flux, and about 400 degrees F. Each time I attempt this most of the legs get soldered individualy but there is always a few that clump or get a puddle effect, and I have to use the copper to separate them.. The videos on youtube make it look effortless with the required tools. What am I doing wrong?
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48 pin Chip, hot air station soldering, what am I doing wrong?
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Re: 48 pin Chip, hot air station soldering, what am I doing wrong?
i flood the chip with solder and flux and use hot air to remove, then use iron to solder in place, run solder with the iron down the sides of the chip useing flux, and then use 5mm braid to remove the non wanted solder from between the pins/legs, and i use a USB microscope to check
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Re: 48 pin Chip, hot air station soldering, what am I doing wrong?
Look here https://www.youtube.com/watch?v=wUyetZ5RtPs
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