I'm wondering how crucial it is to remove as much of the old solder on a bga chip and corresponding PCB pads.
Is it best practice to always wick before applying fresh leaded solder? (Presuming most original solder will be lead-free)
Or could you just make a few passes with a big glob of leaded solder across the pads with the iron?
Any side effects if both types of alloys mix together?
Is it best practice to always wick before applying fresh leaded solder? (Presuming most original solder will be lead-free)
Or could you just make a few passes with a big glob of leaded solder across the pads with the iron?
Any side effects if both types of alloys mix together?
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