Quote:
Originally Posted by diif
BGA is ball grid array. The way the main chip is soldered to the board.
Resistor R810 is marked 4493 which is 400 kohm, not 4.7 Mohm as described in that thread. Which also mentions no power. You have power.
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So do you mean re-flowing the solder or re-attaching that chip? I have a heat gun but not a hot air gun if that's what it takes. I was given this monitor for free by a family member and am trying to give it some life back without investing too much into it.
I will try to take more pictures tonight and test the caps on the power board.