I have been trying to re-ball some chips on some phones with stencils and some solder paste. It was cheap paste from China, not sure if thats the problem or my technique.
I've watched lots of youtube videos and seams to work easily for people.
I hold the stencil down over the chip with the tweezers, apply paste and wipe excess off with tissue or a blade. I check under the Micrsocope.
Then on my digital hot air I set lowest setting of 1 litre of air out of 120!!
Tried temps around 350 to 400, previously tried higher air.
The problem is everytime without fail the paste jumps out and balls up all over making a right old mess! Leaving empty holes, some with massive sticking out balls etc etc. Its like its alive!
I tried leaving the paste out to harden as recommended by someone doing videos in vietnam, this improved it, made it stiffer but still some popped out.
Any ideas please what I'm doing wrong?
Cheers.
I've watched lots of youtube videos and seams to work easily for people.
I hold the stencil down over the chip with the tweezers, apply paste and wipe excess off with tissue or a blade. I check under the Micrsocope.
Then on my digital hot air I set lowest setting of 1 litre of air out of 120!!
Tried temps around 350 to 400, previously tried higher air.
The problem is everytime without fail the paste jumps out and balls up all over making a right old mess! Leaving empty holes, some with massive sticking out balls etc etc. Its like its alive!
I tried leaving the paste out to harden as recommended by someone doing videos in vietnam, this improved it, made it stiffer but still some popped out.
Any ideas please what I'm doing wrong?
Cheers.
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